Intel's Integrated Photonics Solutions (IPS) organization is driving the future of high-performance computing and networking through the development of advanced optical interconnect technologies built on Intel's silicon photonics platform.
Position Overview
Lead the development and industrialization of next-generation silicon photonics and high-speed optical products from concept through high-volume manufacturing. Drive technical execution, manufacturing readiness, and cross-functional decision-making to deliver products that meet performance, quality, cost, and schedule objectives.
Key Responsibilities
• Lead matrixed teams across design, fab, assembly, test, quality, and operations to define and execute the product Plan of Record (POR).
• Drive end-to-end development of Photonic ICs (PICs), Electronic ICs (EICs), and manufacturing process technologies from concept through production ramp.
• Balance technical tradeoffs, business priorities, cost, schedule, and risk to enable informed decision-making and successful product execution.
• Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment.
• Drive manufacturing readiness, including wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification.
• Serve as the primary interface to stakeholders and leadership, providing clear communication of product status, risks, and recommendations.
• Build strong partnerships across organizations to accelerate execution and deliver business results.
• Interface with fab, optical design, hardware, firmware, IC design, test, operations, and quality teams to ensure successful product development and manufacturing ramp.
What We're Looking For
You should demonstrate the following professional traits to be successful:
• Strong collaborative leadership to effectively guide cross-functional, matrixed engineering and operational teams.
• Analytical decision-making to balance complex technical tradeoffs with business priorities, costs, and schedule constraints.
• Proactive communication and stakeholder management to clearly convey product status, risks, and recommendations to leadership.
Minimum Qualifications
• BS in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience, or a Master's degree with 4+ years of relevant industry experience.
• 3+ years of experience in one or more of the following:
• High-speed optical component or product development
• Silicon photonics development
• Semiconductor fabrication process development
• Wafer-level assembly or packaging development
• Test development and validation
Preferred Qualifications
• Experience in silicon photonics, optical transceivers, or semiconductor product development, plus 2 or more of the following skills:
• 3+ years of semiconductor fab process experience
• 3+ years of assembly, packaging, or manufacturing process experience
• Proven track record of leading cross-functional engineering teams and successfully transitioning products from development to high-volume manufacturing
Join us in shaping the future of technology by bringing your expertise and passion to Intel's Silicon Photonic Design team.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, New Mexico, AlbuquerquePosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience
- Master's degree in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 4+ years of relevant industry experience
- 3+ years of experience in high-speed optical component or product development
- 3+ years of experience in silicon photonics development
- 3+ years of experience in semiconductor fabrication process development
- 3+ years of experience in wafer-level assembly or packaging development
- 3+ years of experience in test development and validation
- Experience in silicon photonics, optical transceivers, or semiconductor product development
- 3+ years of semiconductor fab process experience
- 3+ years of assembly, packaging, or manufacturing process experience
- Proven track record leading cross-functional engineering teams and transitioning products from development to high-volume manufacturing
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
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