Senior Process Engineer (Plating)

About the Role

We are seeking an experienced Senior Process Engineer (Plating) to lead and sustain high-performance plating processes in a high-volume semiconductor manufacturing environment. This role is critical in ensuring process stability, yield improvement, and continuous enhancement of plating technologies across advanced semiconductor packaging platforms.

What You Will Do

• Lead and manage sustaining and continuous improvement of plating processes and equipment across multiple semiconductor package types.

• Perform routine process evaluations to ensure alignment with defined capability, performance, and quality standards.

• Identify, analyze, and eliminate sources of process variation and deviations, driving corrective and preventive actions to improve yield and inline performance.

• Own and execute Lot-On-Hold (LOH) dispositions, working closely with treatment teams to accelerate lot recovery and minimize production delays.

• Collaborate with equipment engineering teams to validate new product designs during development and qualification for High Volume Manufacturing (HVM).

• Maintain and update technical documentation, including control plans, process specifications, SOPs, FMEAs, and technical reports.

• Strategically plan and manage technician coverage to support 24/7 operations, ensuring effective task delegation and operational transparency.

• Mentor and develop technicians by strengthening engineering fundamentals, setting KPIs, and conducting annual performance evaluations.

• Partner with R&D, NPI, product design, and reliability teams to align plating equipment capabilities with package architecture and process requirements.

• Troubleshoot and resolve plating-related defects using structured engineering and data-driven analysis.

• Support smooth technology, chemical, process, and equipment transfers into HVM production.

• Contribute to the advanced packaging technology roadmap, including thin form factors and emerging device architectures.

• Drive continuous improvement initiatives such as Manufacturing Value Add (MVA) reduction, yield enhancement, and UPH optimization.

• Coordinate with suppliers and vendors for jig and fixture procurement, ensuring timely delivery of spare and non-spare parts.

• Thrive and perform effectively in a fast-paced, high-volume manufacturing environment.
   

What You Will Need

• Bachelor’s degree in engineering (Chemical Engineering background strongly preferred).

• Minimum 5 years of semiconductor industry experience, with at least 3 years specializing in plating processes.

• Hands-on experience with plating equipment used in semiconductor packaging.

• Strong proficiency in statistical analysis tools such as JMP and Minitab.

• Excellent documentation and technical reporting skills.

• Solid understanding of chemical interactions with materials, including metal alloys and epoxy compounds (preferred).

• Strong commitment to Environmental, Health & Safety (EHS) standards and chemical handling compliance.

• Proven ability to work cross-functionally and lead process improvements in a manufacturing environment.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.