The Role
Lead development and optimization of wafer coring processes to improve yield, quality, throughput and equipment performance. Drive continuous improvement, root-cause analysis, DOE/SPC-based improvements, and collaborate with equipment, production and quality teams to ensure scalable, robust manufacturing.
Summary Generated by Built In
As our Senior Process Engineer in Wafer Coring, you'll play a key role in developing and optimising wafer coring processes that support the manufacture of advanced semiconductor devices. You'll drive improvements in process capability, mechanical yield, wafer quality and production efficiency, helping to ensure robust and reliable manufacturing performance.
You'll have the opportunity to lead continuous improvement initiatives, tackle complex process
challenges and identify innovative solutions that enhance manufacturing capability. Working
closely with colleagues across Engineering, Production, Equipment and Quality, you'll help deliver stable, scalable and high-performing wafer coring operations while supporting the development of next-generation technologies.
We're looking for someone who combines strong technical expertise with a proactive, hands-on
approach to problem solving. If you're passionate about process optimisation, delivering measurable improvements and working with cutting-edge semiconductor technology, this is an
opportunity to make a real impact.
This role is primarily Monday to Friday, 8:00am to 4:30pm, with weekend support required on a rotating basis approximately once every three weeks. There may also be occasional requirements to work additional hours to support critical business needs and project deadlines.
This role is primarily Monday to Friday, 8:00am to 4:30pm, with weekend support required on a rotating basis approximately once every three weeks. There may also be occasional requirements to work additional hours to support critical business needs and project deadlines.
Key Responsibilities
- Own and maintain wafer coring processes performance, ensuring compliance with quality,
- cost, throughput, and metrics targets.
- Define and optimise process parameters, establish control plans, and maintain operating
- specifications and procedures for wafer coring processes.
- Initiate and drive continuous improvement programs focused on yield enhancement, cycle
- time improvement, defect reduction, and cost optimisation.
- Monitor process capability metrics, perform data analysis and implement improvement
- actions to ensure robust process control.
- Investigate technical and quality issues using structured problem-solving methodologies and provide timely engineering disposition.
- Evaluate the processability of new products, device under development, and deliver sound process engineering recommendations.
- Collaborate with equipment engineering and tool suppliers to improve equipment reliability, uptime, and performance.
- Provide technical training and support to operations and engineering team.
Skills, Knowledge and Expertise
- A minimum HNC in Electrical or Electronic or Mechanical Engineering is preferred or suitable experience.
- Minimum 5 years of experience in wafer pre-assembly or die preparation processes. Wafer Coring experience or Equipment know-how is an advantage.
- Hands-on process engineering experience on wafer Dicing, Backgrinding, Edge Grinding and Polishing, Laser Grooving and Marking processes.
- In-depth knowledge and understanding on process application and material selection used in wafer Coring.
- Strong understanding on DOE, SPC, FMEA, OCAP and data analysis methodologies.
- Demonstrate continuous improvement mindset, high level of commitment, analytical and problem-solving skills.
- Ability to multi-task, work in flexible assignments, and deliver effective result without close supervision.
Benefits
- Pension scheme
- Private medical & dental insurance
- 28 days’ holiday + bank holidays
- Free onsite meals
- Onsite gym
- Relocation support
- Visa support available
About
About PlesseyWe’re building the hardware foundation for next-era computing.Plessey is a world-leading technology company driving the next generation of photonic devices and systems. With over 70 years of innovation, we combine research, materials science, process engineering, and manufacturing under one roof. We’re recognised as a global authority in microLED displays, optical computing, and optical interconnects.Join us to work on breakthrough technologies shaping the future of light-based technology and computing.LeadWe don’t follow industry trends; we create them, pushing boundaries and setting standards others aspire to. Every team member has the power to make decisions, drive change, and deliver excellence. We support each other, challenge one another for the best solutions, and lead by example. Together, we build industries and technologies that shape the future and scale toward our vision of the next era of computing.GrowWe expand our capabilities every day — deepening our expertise, improving how we work, and pushing the boundaries of what’s possible. Curiosity fuels us: we question assumptions, explore new ideas, and innovate with light-based technologies. By investing in and empowering our people, we strengthen Plessey’s impact and help shape the future of optical technology.TrustWe operate like a family—honest, reliable, and supportive. We have each other’s backs, own our actions, and uphold the highest standards of integrity and safety. We trust each other to deliver, our customers to challenge us, and our expertise to guide the way. Together, trust enables the collaboration essential for breakthrough innovation and lasting impact.
Skills Required
- Minimum HNC in Electrical, Electronic or Mechanical Engineering or suitable experience
- Minimum 5 years of experience in wafer pre-assembly or die preparation processes
- Wafer Coring experience or equipment know-how
- Hands-on process engineering experience on wafer dicing, backgrinding, edge grinding, polishing, laser grooving and marking
- In-depth knowledge of process application and material selection used in wafer coring
- Strong understanding of DOE, SPC, FMEA, OCAP and data analysis methodologies
- Continuous improvement mindset, strong analytical and problem-solving skills
- Ability to multitask, work on flexible assignments and deliver results without close supervision
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The Company
What We Do
Plessey is a UK-based technology company specializing in the design and manufacturing of advanced microLED display solutions. They utilize a proprietary GaN-on-Silicon platform to produce high-performance, high-density RGB pixel arrays for applications in Augmented Reality (AR), Virtual Reality (VR), and other head-mounted display systems. The company operates integrated manufacturing facilities in Plymouth, England, focusing on the next generation of photonic technologies for computing and display engines.
