Be an Early Applicant
Talent Solutions for the AI Era
The Role
Lead board and system hardware design for high-speed networking and AI platforms. Own architecture, schematic design, PCB layout guidance, board bring-up, SI/PI review, validation, and customer technical engagements. Collaborate across silicon, firmware, and systems teams to optimize performance, produce reference designs, and deliver documentation and training.
Summary Generated by Built In
Required Qualifications
- Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or a related field.
- 15+ years of hardware design, development, and validation experience for high-speed networking or compute systems.
- 7+ years of board and system design experience supporting high-speed platforms with 25G NRZ to 112G/224G PAM4 SerDes.
- Strong experience owning the complete board design lifecycle, including architecture, schematic design, layout guidance, board bring-up, and validation.
- Experience developing and delivering hardware reference designs for customer or internal platform adoption.
- Expertise in:
- High-speed PCB stack-up and material selection
- Power architecture for high-current ASICs (PDN, sequencing, decoupling, tolerance analysis)
- Thermal design and mechanical integration
- Signal Integrity (SI) and Power Integrity (PI)
- Hands-on experience with hardware bring-up, debugging, root-cause analysis, and lab equipment.
- Strong knowledge of high-speed interfaces including Ethernet, PCIe, DDR, and modern SerDes technologies.
- Experience with Design for Reliability (DFR), Design for Manufacturability (DFM), and Design for Testability (DFT).
- Customer-facing experience supporting technical engagements and resolving deployment issues.
- Excellent communication and technical presentation skills.
- Experience with Ethernet switch platforms and AI networking/fabric architectures.
- Experience designing platforms for hyperscale or megascale data centers.
- Knowledge of ODM/CM manufacturing, qualification, and reliability testing.
- Experience with advanced cooling technologies (liquid or immersion cooling).
- Hands-on experience with Cadence Allegro/Sigrity or Mentor/Siemens Xpedition/HyperLynx.
- Proven ability to influence product roadmaps and collaborate with cross-functional engineering teams.
- Lead board and system hardware design for high-speed networking and AI platforms.
- Drive architecture, schematic development, PCB layout reviews, hardware validation, and board bring-up.
- Collaborate with silicon, firmware, and systems engineering teams to optimize platform performance.
- Review SI/PI analysis and support customer design reviews.
- Provide technical leadership during customer engagements and platform deployment.
- Develop technical documentation and deliver engineering training.
- Serve as the technical bridge between customers, hardware engineering, and silicon development teams
California Pay Range
$200,000—$250,000 USD
Skills Required
- Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or related field.
- 15+ years of hardware design, development, and validation experience for high-speed networking or compute systems.
- 7+ years of board and system design experience supporting high-speed platforms with 25G NRZ to 112G/224G PAM4 SerDes.
- Proven experience owning the complete board design lifecycle: architecture, schematic design, layout guidance, board bring-up, and validation.
- Experience developing and delivering hardware reference designs for customer or internal platform adoption.
- Expertise in high-speed PCB stack-up and material selection.
- Power architecture experience for high-current ASICs (PDN, sequencing, decoupling, tolerance analysis).
- Thermal design and mechanical integration experience.
- Signal Integrity (SI) and Power Integrity (PI) expertise.
- Hands-on experience with hardware bring-up, debugging, root-cause analysis, and lab equipment.
- Strong knowledge of high-speed interfaces including Ethernet, PCIe, DDR, and modern SerDes technologies.
- Experience with Design for Reliability (DFR), Design for Manufacturability (DFM), and Design for Testability (DFT).
- Customer-facing experience supporting technical engagements and resolving deployment issues.
- Excellent communication and technical presentation skills.
- Experience with Ethernet switch platforms and AI networking/fabric architectures.
- Experience designing platforms for hyperscale or megascale data centers.
- Knowledge of ODM/CM manufacturing, qualification, and reliability testing.
- Experience with advanced cooling technologies (liquid or immersion cooling).
- Hands-on experience with Cadence Allegro/Sigrity or Mentor/Siemens Xpedition/HyperLynx.
- Proven ability to influence product roadmaps and collaborate with cross-functional engineering teams.
Am I A Good Fit?
Get Personalized Job Insights.
Our AI-powered fit analysis compares your resume with a job listing so you know if your skills & experience align.
Success! Refresh the page to see how your skills align with this role.
The Company
What We Do
We provide Talent Solutions for the AI Era. Our mission is to connect businesses with exceptional talent and consulting solutions that align with your company’s culture and values. We offer AI consulting services to enable businesses in leveraging cutting-edge artificial intelligence. We help discover, design and deploy AI solutions that streamline operations, boost productivity, and unlock new growth opportunities. Our team of AI experts, strategists, and technology specialists work closely with organizations to integrate AI-driven solutions that align with their unique goals and challenges. From automation and data analytics to predictive modeling and AI-based customer experiences, we provide end-to-end support for businesses embarking on their AI transformation journey.
.png)
