Senior Optical Packaging Process Engineer

We believe quantum computing will change everything.  It will have the power to transform the foundations of giant industries that rely on intensive computation.  PsiQuantum is on a mission to build the world’s first useful quantum computer, capable of delivering these transformative results.  We know that means it will need 1 million qubits, error correction, a scalable architecture and a data center footprint.

By harnessing the laws of quantum physics, quantum computers can provide exponential performance increases over today’s most powerful supercomputers, offering the potential for extraordinary advances across a broad range of industries including climate, energy, healthcare, pharmaceuticals, finance, agriculture, transportation, materials design, and many more. 

PsiQuantum is uniquely positioned to deliver on the promise of quantum computing years earlier than our competitors. Our architecture is based on photonics which gives us the ability to produce our components using existing high-volume semiconductor manufacturing processes, the same processes that are today producing billions of chips for telecom and consumer electronics applications. Since photons don’t feel heat, we can take advantage of existing cryogenic cooling systems, the kind that have been operating at facilities like the Stanford Linear Accelerator (SLAC).  And because photons are in fact light, they can move between subsystems at tremendous speed using standard fiber connectivity.

Our team is building a utility scale quantum computer and the software tools needed to build fault tolerant quantum applications. We’re a highly motivated and collaborative group focused on a singular goal - building the world’s first useful quantum computer on the fastest path possible. 

There’s much more work to be done and we are looking for exceptional talent to join us on this extraordinary journey! 

Job Summary:

The Optical Packaging Process Engineer is responsible for defining and executing the chip-level manufacturing process for advanced fiber-coupled chip-level photonic integrated circuits (PICs).  

Responsibilities:

• Work with the optical packaging engineers to define the packaging-facing requirements for the PIC.
• Develop fabrication process for postprocessing PICs to meet optical packaging requirements.
• Perform chip processing and post-postprocessing in a prototype cleanroom.
• Work with external vendors on key steps and chip fabrication process transfer.
• Feed back package-facing chip manufacturability constraints to packaging engineers, foundry engineers and PIC design engineers.
• Perform metrology and failure analysis on incoming and postprocessed chips  

Mandatory Experience/Qualifications:  

• Bachelor’s Degree or above in Engineering, Physics or Material Science. 
• 7+ years of experience working on semiconductor manufacturing processing in a cleanroom.
• Extensive experience with rapid prototyping.
• Extensive experience with RIE, ICP, wet processing.
• Experience with IBE, contact lithography, SEM 

Nice to have: 

• PVD and electroplating experience is a plus.
• Experience with optical fibers is a plus.
• Experience with FA and 8D failure resolution techniques.
• Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.
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