Senior Layout Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Senior Layout Engineer at Micron, you will play a pivotal role in developing our innovative HBM components. This ambitious role requires you to:

• Perform block-level and top-level layout for high-bandwidth memory (HBM) components.
• Support advanced technology nodes and HBM-specific build rules during layout development.
• Implement layouts for 2.5D and 3D integration, including through-silicon vias (TSVs), micro-bump arrays, keep-out zones, alignment constraints, and interposer or die-to-die interfaces.
• Run and debug design-rule checking (DRC), layout versus schematic (LVS), electrical-rule checking (ERC), and density checks to achieve clean signoff.
• Support and interpret parasitic extraction (PEX) or equivalent experience, electromigration and voltage-drop (EM/IR) analysis, and reliability checks; implement required layout updates.
• Ensure compliance with foundry build rules, reliability guidelines, and process constraints.
• Collaborate with analog and mixed-signal designers to refine floorplans and address performance or layout tradeoffs.
• Partner with physical build, packaging, and signal-integrity (SI) teams on top-level integration, pin assignment, and power distribution.

We are looking for candidates who bring the following to our team:

• Bachelor’s or Master’s degree in Electrical Engineering or a related field, or equivalent practical experience.
• 8+ years of experience in custom analog or mixed-signal coordinated circuit (IC) layout.
• Understanding of noise coupling, substrate effects, and power-integrity considerations.
• Familiarity with advanced process nodes such as fin field-effect transistor (FinFET) or deep-submicron complementary metal-oxide-semiconductor (CMOS).
• Ability to independently own layout blocks from floorplanning through tape-out.

Ideal candidates will have:

• Experience supporting 2.5D or 3D integration flows for HBM or similar high-density technologies.
• Background working with TSVs, micro-bumps, and interposer-based layouts.
• Practice coordinating with cross-functional teams across packaging, physical build, and signal-integrity workflows.
• Experience delivering layout for advanced-node builds with reliability and signoff requirements.

Join us in our mission to successfully implement world-class memory solutions that transform information into intelligence!

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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