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Job Description:As a Senior Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start-up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.
You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams.
Key Qualifications & Experience:
Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories.
Precision Scopes, Analyzers, development & validation tools.
Power and Thermal issues associated with PCBs with 1kW+ footprints
High-speed & High-density signaling with SerDes rates of 112G+
Demonstrate lifecycle product ownership of complex products. Participating in a cross-functional team from product inception to volume production
Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability
Bachelor's degree in electrical engineering and 5+ years of related experience
Compensation and Benefits
The annual base salary range for this position is CAD 76,300.00 To CAD 122,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, RRSP participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays; and paid sick leave and vacation time. The company follows all applicable laws for leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Bachelor's degree in Electrical Engineering
- 5+ years of related electrical/hardware engineering experience
- Experience with large high-powered SoCs and advanced silicon/packaging (2D, 2.5D, 2.5D with 3D memories)
- Experience with precision scopes, analyzers, and development/validation tools
- Expertise addressing power and thermal issues for PCBs with 1kW+ footprints
- Experience with high-speed, high-density signaling and SerDes at 112G+
- Demonstrated lifecycle product ownership from inception through volume production
- Ability to work with cross-functional support groups (Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, Sustainability)
- Ownership of all aspects of EE hardware design including BOM creation, vendor negotiations, circuit/board design, development, and validation
- Ability to provide technical leadership to a small design team
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.








