Senior Failure Analysis Engineer

Location: Burlington, ON. (On-Site)

Our Team:
Semtech Corporation is a high-performance semiconductor, IoT systems and Cloud connectivity service provider dedicated to delivering high quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are dedicated to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets.

Responsibilities:

• Performs die level and package level failure analysis of customer and internal failures by independently utilizing multiple FA tools and techniques with no supervision.

• Generate formal FA reports for customers and internal requestors to summarize and communicate the technical analysis results.

• Works and collaborates with various engineering teams such as QA &Reliability, Design, Applications, Wafer Fab, Assembly, Product and Test Engineering as appropriate, for root cause analysis and resolution of customer and internal issues.

• Participates in continuous FA technique development and process improvements, monitoring and maintenance of laboratory supplies and consumables, optimization and maintenance of laboratory tools and equipment.

Minimum Qualifications:

• Bachelor’s degree in Engineering Physics, Electrical or Electronics Engineering.

• 7+years experience in semiconductor Failure Analysis. Additional experience in the following engineering disciplines would be an advantage: Product Quality and Reliability, Test/Product Engineering, Design/Validation/Characterization, Applications, and Wafer Fab.

• Must have hands-on experience in operating the following FA equipment: Curve Tracer/Parametric Analyzer, Scanning Acoustic Microscope, SEM/EDX, Photon Emission/Laser Signal Injection Microscope, Microprober. Hands-on experience on FIB X-sectioning, Circuit Edit FIB, Nanoprobing/EBIC/EBAC techniques would be an advantage.

• Must have hands-on experience in performing the following physical FA steps: chemical decapsulation/deprocessing/staining, mechanical/parallel lapping, mechanical cross-sectioning/polishing/ion milling (optional).

• Proficient in electrical circuit analysis, bench testing and instrumentation.

• Knowledge in IC fabrication, semiconductor physics, BJT and MOSFET theories and basic circuit configurations.  

• Strong verbal and written communication skills, analytical and problem-solving skills, teamwork and cross-functional team coordination.

• Proficient in MS Word, PowerPoint and Excel.

• Must be willing to work in a laboratory environment with occasional flexible hours to meet urgent customer requests and expectations as necessary.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

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