Senior FA Engineer

Luminus is a vertically integrated fast-growing high-tech company that engages in high power Light-Emitting-Diode (LED) solid-state lighting for a variety of application areas such as industrial UV, IR, medicals, projection displays, high-end illumination lighting, horticulture lighting and automotive lighting. Luminus is at the forefront of the undergoing solid-state lighting revolution that will change the lighting technology in almost every aspect of our everyday work and life. If you are looking for a place that you can grow, work hard and have fun this is a GREAT opportunity to learn about the lighting technology world and be part of an exciting forward company!

Job Responsibilities:

1. Responsible for failure analysis of customer complaints, hypothesis root cause, conduction RC DOE or apps simulation and completed the customer presentable 8D reports. 
2. Perform in-depth failure analysis during NPI/New supplier or materials introduction, qualification and mass production failures Docusign Envelope ID: 6555BA24-03BB-426B-9FF6-48675BC1252F.
3. Responsible for communication with internal factory/other departments, feedback failure issues, tracking root cause analysis and corrective and preventive actions, and completion of 8D report. Work with the Product, Process and supplier Engineers to establish the root cause hypothesis.
4. Create and maintain the analysis information/report/database. 
   

Qualifications:

1. Bachelor’s or master’s Degree with Major in electronics/ opto electronics/chemistry/physics/material science is preferred.
2. Proficient in Office software, Excel/Macro and charting, ability to understand LED product level functional and optical test data and analysis charting.
3. 5 years’ working experience in semiconduction and/or LED device & packaging level analysis. Experience in Laser/LED packaging and automotive electronic applications is preferred.
4. Knowledge in a wide range of failure analysis tools & methods, including the typical materials property & micro contamination analysis methods is a must. The failure analysis depth will cover product level (electrical, optical, curve tracer, hot spot, ESD, EOS etc ), packaging level (scope, SEM, FIB, x-section, EDS/EDX, EMMI etc) and materials level analysis (DSC, TMA, micro hardness, hot spot).
5. Rigorous working attitude and good communication skill.
6. Have good English listening, speaking, reading and writing skills. Able to communicate the technical report well with customers and stakeholders.