As a Semiconductor Research Engineer, you will play a crucial role in advancing Intel's assembly and packaging technologies. You will design, develop, and test innovative devices, interconnects, and packaging solutions, leveraging device physics, electromagnetics, and materials science. Your hands-on work will include prototyping and research to optimize performance, reliability, and cost, directly impacting Intel's technological leadership in semiconductor innovation.
Business Group
Intel Corporation's Assembly Materials Characterization Lab, in Core Competency of Advanced Design and Customer Enabling is dedicated to enabling next-generation semiconductor technologies. This group combines cutting-edge research and development to deliver next generation metrology solution for advanced packaging solutions that drive miniaturization, performance enhancements, and functionality. As part of this dynamic team, you will contribute to Intel's mission to enhance technological capabilities and maintain industry leadership.
Key Responsibilities
- Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
- Design and fabricate metrology prototypes to validate groundbreaking concepts for semiconductor assembly and interconnect solutions.
- Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
- Plan and execute experiments with cross-functional teams to benchmark results against industry standards.
- Model and analyze trade-offs between design, performance, and reliability to ensure optimal solutions.
- Collaborate with external vendors and researchers to support Intel's research pipeline.
Behavioral traits:
- Lead and influence technical teams to achieve milestones.
- Analytical and problem-solving abilities to address unique engineering challenges.
- Excellent organizational and communication skills, with experience presenting findings and mentoring team members.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Master's in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience- OR- PhD degree with 2+ years of experience.
- Experience mentioned above should be in the following areas:
- Research, including optical test metrology, Dimensional metrology, and packaging design methodologies.
- Programming skills in Python or MATLAB for engineering applications.
- Experimental setups and data analysis techniques for lab testing.
Preferred Qualifications
- Experience with advanced Co-Packaged Optics (CPO).
- Experience with advanced packaging technologies like EMIB and Foveros architectures.
- Expertise in Design of Experiments (DOE), statistical analysis methods, and model-based problem-solving techniques.
- Familiarity with materials characterization techniques and cross-disciplinary collaboration.
Join a team that thrives on innovation, collaboration, and excellence. Be part of shaping the future of semiconductor technology with Intel-apply today.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Master's degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4 or more years of experience
- PhD degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 2 or more years of experience
- Research experience involving optical test metrology, dimensional metrology, and packaging design methodologies
- Programming skills in Python or MATLAB for engineering applications
- Experience with experimental setups and data analysis techniques for laboratory testing
- Experience with advanced Co-Packaged Optics (CPO)
- Experience with advanced packaging technologies such as EMIB and Foveros architectures
- Expertise in Design of Experiments, statistical analysis methods, and model-based problem-solving techniques
- Familiarity with materials characterization techniques and cross-disciplinary collaboration
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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