RF PCB Designer

We are seeking an expert RF PCB Designer to lead the development of high‑speed, high‑frequency printed‑wire assemblies (PWAs) covering the L‑, S‑, C‑, and X‑band spectra (1–12 GHz). The incumbent will own complete board‑level RF design cycles—from concept, schematic capture, and electromagnetic (EM) simulation through layout, fabrication, assembly, and test—while ensuring compliance with all applicable IPC standards and leveraging state‑of‑the‑art fabrication materials. In addition, this senior designer will mentor mid‑level and junior RF PCB engineers, drive best‑in‑class design‑for‑manufacturability (DFM) practices, and support the program’s security‑controlled environment.

• Lead end‑to‑end RF PCB design for L‑, S‑, C‑, X‑band applications, producing schematics, layout, stack‑up, and documentation that meet performance, size, weight, and power (SWaP) constraints.
• Conduct high‑frequency EM analysis (SIwave, CST‑MICROWAVE STUDIO, HFSS, ADS) to verify insertion loss, return loss, crosstalk, and radiation characteristics
• Select and specify appropriate PCB substrate, prepreg, copper foil, and surface‑finish materials (e.g., PTFE‑based, Rogers, Taconic, liquid‑crystal polymer, low‑loss ceramics, high‑TC, copper‑clad glass, etc.) for each frequency band and power level.
  •  IPC‑2221/IPC‑2222 (General PCB Design)
  •  IPC‑2141 (RF/High‑Speed PCB Design)
  •  IPC‑6012 (Qualification and Performance of Rigid PCBs)
  •  IPC‑2223 (Multilayer PCBs)  
  • IPC‑4101/4102 (Materials)
  • IPC‑2581/2583 (Data Transfer)
  •  IPC‑2224 (Cable & Wire Assemblies)
• Develop and maintain design‑for‑manufacturability (DFM) and design‑for‑test (DFT) guidelines specific to high‑frequency PWAs (controlled impedance, via stitching, grounding strategies, component placement, probe‑pad design, etc.).
• Generate complete manufacturing documentation (GERBER/ODB++, IPC‑2581 files, assembly drawings, test plans, bill of materials, material declaration forms).
• Liaise with fabricators and assembly houses (including controlled‑environment vendors) to validate process capabilities, conduct yield analyses, and resolve production‑related issues.
• Lead technical reviews (Design Reviews, FAI, CDR, PDR) and present findings to cross‑functional teams and program leadership.
• Mentor and coach mid‑level and  junior RF PCB designers, providing technical guidance, code‑review style layout checks, and career‑development support.
• Maintain compliance with security protocols (need‑to‑know, classified data handling, secure workspaces) and ensure all design artifacts are stored in authorized classified repositories.
• Stay current on emerging RF PCB technologies (e.g., 3D‑stacked interposers, embedded passives, metamaterial substrates, additive manufacturing) and recommend adoption where beneficial.
• Contribute to continuous‑improvement initiatives (process optimization, tooling upgrades, knowledge‑base creation).

Standard Job Description: Researches, develops, designs, and tests electrical components, equipment, systems, and networks. Designs electrical equipment, facilities, components, products, and systems for commercial, industrial, and domestic purposes.  Proficient in AI prompting as it applies to this position and practice. 

• Education:  Associates or Bachelor’s degree in Electrical/Electronic Engineering, Microwave Engineering, or a closely related field.
• Clearance: Active Top‑Secret clearance (or ability to obtain one within 90 days of hire)
• Experience:
  • ≥ 15 years of hands‑on RF PCB design experience in L‑, S‑, C‑, X‑band ranges.
  • Demonstrated experience designing Printed Wire Assemblies (PWA) for high‑frequency/high‑power systems.
  • Technical Skills:
  • • Proficiency with high‑frequency PCB layout tools (Allegro/OrCAD, Cadence Allegro, Mentor Xpedition).
    • Expertise in EM simulation (HFSS, CST, ADS Momentum, SIwave).
    • Solid understanding of transmission‑line theory, controlled‑impedance routing, via design, filter integration, and high‑speed signal integrity.
  • Standards Knowledge: In‑depth familiarity with all IPC references listed above, including the ability to interpret and apply them to classified projects.
  • Materials Expertise: Practical knowledge of advanced PCB substrates and finishes (Rogers, Taconic, Isola, Nelco, Duroid, PTFE, ceramic, flexible‑rigid laminates) and the impact of material properties on loss, dielectric constant, thermal expansion, and reliability.
  • Security & Compliance: Proven ability to work in a Top‑Secret environment, handling classified data per DoD/National Security regulations.
  • Soft Skills: Excellent written and verbal communication, strong problem‑solving mindset, and ability to work cross‑functionally with RF, mechanical, firmware, and test teams.

• Advanced Degrees: M.S. or Ph.D. in RF/Microwave Engineering
• Tool Proficiency: Experience with HFSS/CSA, Altium Designer (Altium 3‑D Viewer + integrated FEM), Mentor Xpedition ( Ansys HFSS & CST Studio Suite), SolidWorks PDM, Git‑based version control for PCB data, and PLM/ALM systems.
• Emerging‑Tech Exposure: Work with 3‑D‑printed RF structures, low‑temperature co‑fired ceramic (LTCC), embedded passive components, or integrated antenna‑in‑package designs.
• Testing Experience: Hands‑on involvement with high‑frequency test equipment (VNA, spectrum analyzer, time‑domain reflectometer, low‑noise amplifiers, power meters).