Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:Job Responsibilities:
Drive the quality and reliability strategy for Broadcom’s Silicon Photonics product portfolio.
Collaborate closely with development teams to ensure products are designed for excellence in quality and reliability, communicating effectively to support new product introductions and ramp products to high volume manufacturing.
Manage the end-to-end reliability qualification of silicon photonics devices, transceivers, co-packaged optics, and related technologies. Develop qualification plans and reports that satisfy both customer and Broadcom requirements.
Lead failure analysis investigations to closure, coordinating root cause identification and implementing corrective/preventive actions across cross-functional teams.
Partner with manufacturing teams to facilitate smooth product transfers and volume ramps while maintaining rigorous quality standards.
Uphold best practices for Product/Process Qualifications (PPQ) and Change Management to ensure customer protection and product integrity.
Assist in preparation and hosting of customer visits and audits.
Provide regular quality updates and reports.
Current, relevant experience for the reliability stress, test & failure analysis for 2D, 2.5D, 3D Packages with IC & Photonic IC components.
Current, relevant experience for the reliability stress, test & failure analysis for Device Reliability experience for traditional IC & Photonic IC devices.
Requirements:
Education & Background: Bachelors (+12 years), Masters (+10 years), or PhD (+7 years) in Materials Science, Electrical Engineering, Physics, Chemistry, or a related technical field.
Technical Experience: Demonstrated expertise in quality and reliability for silicon photonics, semiconductor photodiodes, modulators, heaters, wave guides, lasers, fiber optics, or wafer fabrication, IC packaging, or related fields. Previous customer facing experience.
Packaging & Test: Proficiency in advanced packaging (2D/2.5D/3D), design for reliability, design for test, and semiconductor characterization.
Analytics: Advanced skills in statistical analysis (JMP, Python, R, or MATLAB) and database development for transitioning to high-volume manufacturing support.
Professional Skills: Strong communication and customer-facing skills; strong knowledge of reliability and statistical analysis, and failure analysis techniques experience and presenting quality updates.
Soft Skills: Proactive self-starter able to work independently in a Lean, fast-paced environment; willingness to travel up to 10%. Strong analytical and communication skills. Able to work independently with minimal supervision.
Compensation and Benefits
The annual base salary range for this position is To
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Bachelors (+12 years), Masters (+10 years), or PhD (+7 years) in Materials Science, Electrical Engineering, Physics, Chemistry, or related field
- Expertise in quality and reliability for silicon photonics, semiconductor photodiodes, modulators, heaters, waveguides, lasers, fiber optics, or wafer fabrication
- Experience with IC packaging and advanced packaging (2D, 2.5D, 3D) and semiconductor characterization
- Experience in reliability stress, test, and failure analysis for 2D/2.5D/3D packages with IC and photonic IC components
- Proficiency in statistical analysis tools and languages (JMP, Python, R, or MATLAB) and database development
- Strong communication and customer-facing skills; ability to present quality updates and host customer audits
- Experience developing qualification plans and reports that satisfy customer and company requirements
- Experience driving failure analysis investigations, root cause identification, and implementing corrective/preventive actions
- Ability to partner with manufacturing teams for product transfers and volume ramps and knowledge of PPQ and Change Management
- Proactive self-starter; able to work independently in a fast-paced, Lean environment
- Willingness to travel up to 10%
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
-
Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
-
Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
-
Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.


.jpg)





