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Job Description:- Responsible for the design and implementation of packaging processes for new isolation products.
- Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.
- Conduct Design of Experiments (DOE) and optimize newly developed processes.
- Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.
- Perform process yield analysis and failure investigations for new device-related issues.
- Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.
Requirement:
- We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.
- Strong background in Mechanical Engineering and semiconductor packaging process development.
- Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.
- Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.
- Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.
- Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.
- Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.
- Experience in Solidworks/ Ansys, CAD and simulation tools
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Experience with Optocoupler products
- Background in Mechanical Engineering and semiconductor packaging process development
- Hands-on experience with Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form
- Experience with Vision Inspection tools
- Experience conducting Design of Experiments (DOE) and process optimization
- Familiarity with mechanical leadframe design rules/tools
- Knowledge of semiconductor physical failure analysis
- Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques
- Experience leading NPI projects from verification/qualification to high-volume soft launch
- Experience with SolidWorks, Ansys, CAD and simulation tools
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.

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