Quantum NCG 3DHI Engineer

Posted Yesterday
Be an Early Applicant
2 Locations
In-Office
85K-146K Annually
Entry level
Semiconductor • Manufacturing
The Role
Develops 3D heterogeneous integration and advanced semiconductor packaging processes for quantum applications. Responsibilities include wafer-to-wafer and die-to-wafer bonding development, collaboration with unit process engineers, suppliers, and OSATs, materials and tooling characterization, failure-mode analysis, yield improvement, cycle-time and cost reduction, and generating intellectual property. The role is designed for new college graduates and requires an engineering or materials science degree, internship or co-op experience, strong academics, and up to 10% travel.
Summary Generated by Built In

About GlobalFoundries: 

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. 

 

New College Graduate Overview:   

We offer many full-time employment paths for recent graduates, which provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates are provided with mentorship, networking, and leadership opportunities, which give our new team members life-long connections and skills. 

 

Summary of Role: 

GlobalFoundries is seeking a motivated R&D bonding integration engineer to become part of our Quantum Advanced Packaging team This role will entail 3D heterogeneous integration (3DHI) development including wafer-to-wafer and die-to-wafer bonding. 

 

Essential Responsibilities: 

  • Drive 3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materials suppliers for the Quantum Advanced Packaging projects. 

  • Collaborate with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes  

  • Develop expertise in the processes, materials and tooling leveraging available characterization resources  

  • Drive a mechanistic understanding of failure modes. 

  • Develop integration schemes to continuously improve yields and to reduce cycle time & costs. 

  • Generate IP related to novel wafer integration & packaging technology. 

  • Work and collaborate with other teams regarding different assignments as needed. 

 

Other Responsibilities: 

  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 

  • Other duties as assigned by manager. 

 

Required Qualifications: 

  • Education – Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. 

  • Prior related internship or co-op experience.   

  • Must have at least an overall 3.0 GPA and proven good academic standing. 

  • Language Fluency - English (Written & Verbal). 

  • Travel - Up to 10%. 

 

Preferred Qualifications: 

  • PhD education level preferred.  

  • Fundamental knowledge of semiconductor packaging process modules and integration. 

  • Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.  

  • Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.   

  • Strong written and verbal communication skills. 

  • Strong planning and organizational skills. 

#NCGProgramUS 

Expected Salary Range

$85,000.00 - $146,000.00

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at [email protected] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. 

 

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. 

 

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. 

 

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law 

Skills Required

  • Bachelor’s or master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field from an accredited program
  • Prior related internship or co-op experience
  • Overall GPA of at least 3.0 and proven good academic standing
  • English language fluency, written and verbal
  • PhD education level
  • Fundamental knowledge of semiconductor packaging process modules and integration
  • Prior leadership experience in the workplace, school projects, competitions, or similar activities
  • Project management skills and ability to innovate, execute solutions, and navigate ambiguity
  • Strong written and verbal communication skills
  • Strong planning and organizational skills

GlobalFoundries Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about GlobalFoundries and has not been reviewed or approved by GlobalFoundries.

  • Healthcare Strength Comprehensive medical, dental, vision, life, disability, and mental health support is presented as a meaningful part of the package. Wellness programs and an Employee Assistance Program add to the sense of broad health coverage.
  • Retirement Support A 401(k) with matching from day one and access to an employee stock purchase program are positioned as notable financial benefits. Retirement provisions are repeatedly framed as a strong counterweight to other compensation concerns.
  • Leave & Time Off Breadth Time-off provisions are described as generous, including high annual vacation accrual, dedicated sick time, and additional personal days. Extended paid parental leave frameworks are also outlined as a substantial leave benefit.

GlobalFoundries Insights

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The Company
HQ: Malta, NY
12,676 Employees
Year Founded: 2009

What We Do

GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers. GF is redefining innovation and semiconductor manufacturing by developing and delivering feature-rich process technology solutions that provide leadership performance in pervasive high growth markets. GF offers a unique mix of design, development, and fabrication services. With a talented and diverse workforce and an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its worldwide customers. For more information, visit www.gf.com. GlobalFoundries is an Equal Employment Opportunity/Affirmative Action (EEO/AA) employer Minorities/Female/Disabled/Veteran (M/F/D/V).#CB

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