QFN FC Process Development Engineer

Job Purpose

· Ag Sintering Process Development for Power Module and Discrete with SiC

· New Process and Package Development for High Power Discrete and Module Package

· New Sintering Material Development for Discrete and Module

· Technical leader for Sintering Development Activities communicating with Manufacturing,

BU and SLO

· Mentor of junior process development and package development engineers, technicians

and interns in Suzhou package development group for sintering process

· Support Process Development team under ATPDG

Duties and Responsibilities

1. Power Package Process and material Development and its related Enabling Technology development

i. Responsible to conduct package development following Advanced Product Qualification Plan (APQP) Spec.

ii. Responsible for designed package’s internal, external outline, lead frame, process flow, reliability, cost structure with designer to meet new product or package development goals.

iii. Responsible to develop process and package to secure robust manufacturability, meet Quality requirements, Reliability, finance goal, product performance, Cost and Schedule and transfer to Manufacturing team for safe launch

iv. Responsible for development to meet design Rule and updated Design Rule and design rule updating.

v. Study and understand customer requirements, application, EHS and design those things to package development.

vi. Generate and create development documents deliverables assigned to Package Engineering, such like design MFEA, control plan, process FMEA, look ahead reliability (LAR) plan, project charter, Quality function development, project schedule, line certification plan, to identify development cost, etc.

vii. To plan and execute process optimization, failure analysis, process characterization, samples build for package development.

viii. To find technical and systematic solution and scheduling for failures of reliability, quality, manufacturability, cost, and cycle time.

ix. Conduct DFM (Design for Manufacturing) review by holding technical and financial leadership for package development working with project member such like Industrial Engineering, Finance, SCM, Purchasing, Process Engineering, QA, Program management, Human resource, Facility, and manufacturing

x. To share and update project progress, risk of delay, constraints, weekly at designated day to department manager

2. Mentor of junior process development and package development engineers, technicians and interns in Suzhou package development group for assembly processes

3. Leadership and Communication

i. Communicate with cross sites (e.g Bucheon Korea and Malaysia) for technical things

ii. Decision making of project feasibility for New Material, Process and Package development

iii. Coaching and leading junior engineers to get certain level of grade to meet job quality

iv. Communication and with Manufacturing team for cost reduction idea generation and proposal

Qualifications

· Experienced years : Longer than 5 years in Semiconductor FOL Process.

· Experienced areas : FOL of Sintering, Die Bond process.

· Experienced jobs : Semiconductor Assembly Process Development, Equipment and Tooling set-up, process/equipment/material troubleshooting and control, Purchase spec/selection, Qualification for equipment and material, Experience of consulting on sintering process and equipment.

· Experienced packages : Semiconductor Packages, Highly preferred Power discrete (like TO220, D-Pak, D2PAK) and Power module packages (like APM, SPM, IPM, IGBT/Diode module)

· Nationality: Chinese

· Education: Minimum 4yrs university graduated, Preferred Master Degree and above.

· Skills: Communication skills, written English and speaking with multi-cultural foreign engineers, MiniTab & Data analysis.

· Other characteristics such as personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk and managing