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People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
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Job Description:
Der Standort Teltow entwickelt und fertigt elektronische Bauteile, die hauptsächlich auf der Surface Acoustic Wave (SAW)-Technologie basieren. Die meisten Produkte sind kundenspezifisch. Unser Standort umfasst Produktionsbereiche mit unterschiedlichen Reinraumklassen für den Front-End- (Waferfertigung) und Back-End-Bereich (Montage). Zur Produktion gehört auch eine umfangreiche HF-Testausrüstung. Wir sind international in den Bereichen Mobilkommunikation, Industrieelektronik, Luft- und Raumfahrt, Verteidigung und Sensorik tätig.
Sie berichten an den Manager Process Engineering und sind Teil des Process Engineering Teams, das für die Backend-Prozesse der Surface Acoustic Wave (SAW) Produktionslinie verantwortlich ist. Als Process Engineer, Backend Process Engineering, benötigen Sie die Bereitschaft, eigenverantwortlich zu handeln, um die Produktion zu unterstützen und Prozesse zu optimieren und weiterzuentwickeln. Darüber hinaus unterstützen Sie das Process Engineering Team in den Bereichen Instandhaltung, Prozesskontrolle und -analyse sowie bei der Entwicklung neuer Montage- und Verpackungstechnologien.
Was ist das Attraktive an dieser Gelegenheit?
In dieser Position lernen Sie eine Vielzahl von verfahrenstechnischen Herausforderungen im Zusammenhang mit Backend-Fertigungstechnologien für akustische Oberflächenwellenfilter und -oszillatoren kennen, wobei der Schwerpunkt auf Verpackungstechnologien liegt.
Weitere Einzelheiten zu den Erwartungen und Verantwortlichkeiten in dieser Position:
- Verantwortung für die Entwicklung und die Backend-Fertigungsprozesse von SAW-Bauelementen.
- Beitrag zu den Anforderungen an neue und optimierte Anlagen, Materialspezifikationen und zugehörige Werkzeuge.
- Unterstützung des Process Engineering Teams und der Produktion bei der Verbesserung der Ausbeute, der Prozessentwicklung und -optimierung sowie der Material- und Fehleranalyse.
- Starkes technisches Interesse und die Fähigkeit, Fertigungsanlagen zu warten und zu reparieren und zunehmend Verantwortung für Prozesse zu übernehmen.
- Bereitschaft und Fähigkeit, mit anderen relevanten Abteilungen zusammenzuarbeiten, um eine hohe Produktivität in der Verfahrenstechnik zu gewährleisten.
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The Teltow site develops and manufactures electronic components based mainly on Surface Acoustic Wave (SAW) technology. Most of the products are customer-specific. Our site includes production areas with different clean room classes for the front-end (wafer production) and back-end (assembly) areas. Production also includes extensive RF test equipment. We are internationally active in the fields of mobile communications, industrial electronics, aerospace, defense and sensor technology.
Reporting to the Manager Process Engineering, you will be part of the Process Engineering team responsible for backend processes of the Surface Acoustic Wave (SAW) production line. As a Process Engineer, Backend Process Engineering, you need the willingness to act on you own authority to support the production and to optimize and further develop processes. You will also be involved in supporting the Process Engineering team in the field of maintenance, process control and analysis as well as the development of new assembly and packaging technologies.
What’s attractive about this opportunity?
This position will expose you to a wide variety of process engineering challenges related to backend manufacturing technologies for Surface Acoustic Wave filters and oscillators with a focus on packaging technologies.
More details on the expectations and responsibilities in this position:
- Responsibility for the development and the backend manufacturing processes of SAW devices.
- Contribution to the requirements of new and optimized equipment, material specifications and related tooling.
- Support of the Process Engineering team and the production regarding yield improvement, process development and optimization, as well as material and failure analysis.
- Strong technical interest and skills to maintain and repair manufacturing equipment and to increasingly take over responsibilities for processes.
- Willingness and ability to collaborate with other relevant departments to ensure high productivity in Process Engineering.
Requirements/Qualifications:
Qualifikationen/Anforderungen:
- abgeschlossenes Ingenieurstudium (Master in Ingenieurwesen oder Physik bevorzugt)
- Erfahrung in Montage- und Verpackungstechnik und/oder Materialanalyse.
- Gute deutsche Sprachkenntnisse in Wort und Schrift.
- Englischkenntnisse zur Kommunikation mit Lieferanten und zum Verstehen von Fachliteratur.
Kompetenzen:
- Erfahrung in Backend-Fertigungstechnologien, vorzugsweise Die- und Wire-Bonding.
- Gutes technisches und elektronisches Verständnis zur Unterstützung der Fertigungsanlagen.
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- Engineer (Master preferred in engineering or physics)
- Experience in assembly and packaging technologies and/or material analysis.
- Good German language skills in speaking and writing.
- English language skills to communicate with suppliers and comprehend technical literature.
Competencies
- Experience in backend manufacturing technologies, preferably die- and wire-bonding.
- Good technical and electronical understanding to support the manufacturing equipment.
Travel Time:
0% - 25%
What We Do
Microchip Technology Inc. is a leading semiconductor supplier of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market.
The company’s solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets.
Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.
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