- Drives and develops testability and manufacturability of integrated circuits from the component feasibility stage through production ramp.
- Contributes to design, development, and validation of testability circuits, test flows, and methodologies for new products through evaluation, development, and debug of complex test methods.
- Interfaces with process development, fab, factory, assembly, quality and reliability, and manufacturing groups to enable postsilicon HVM ramp.
- Evaluates new designs on automatic test equipment (ATE) and works with the design, DFx, and product development teams to debug functionality and performance issues to root cause. Performs ATE device characterization, utilizes that data to define datasheet specifications and performs yield analysis.
- Collaborates with designers to drive design for test/debug/manufacturing (DFT/DFD/DFM) features enabling efficient production testing of new products.
- Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment. Creates and tests validation and production test hardware solutions.
- Tests, validates, modifies, and redesigns circuits to guarantee component margin to specification.
- Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability.
- Ensures manufacturability over process and product design through thorough analysis of process and spec corners and works with design to resolve yield issues before manufacturing ramp.
- Drives test time reduction through analysis of fallout data versus test time for various IPs to balance and drive overall product cost optimizations.
- Analyzes early customer returns with emphasis on driving test hole closure activities.
- Creates and applies concepts for optimizing component production relative to both quality and cost constraints.
- Leads and drives manufacturing readiness from fab, assembly, and test factory to support engineering sample and customer sample generation (ES milestones), wafer start planning, product qual execution strategy and capacity analysis, and assembly and test site certification activities.
- Works with fab, assembly, and test factory partners and planners to support production ramp.
- May also manage execution of new product introductions in the fab, fab process targeting, product/process optimizations, and participate in factory task forces to bring product perspective and respond to product issues.
- Optimizes product supply through data analysis of postsilicon binsplit, die level cherry pick (DLCP), and optimize sort/test content and yield downstream through data analysis.
Minimum Qualifications
- Bachelor’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field with 0-1 years of hands-on experience in the domain, showcasing skills gained through internships, academic projects, coursework, or hands-on training.
- OR a Master’s degree in a relevant field with no prior professional experience.
- Proficiency in programming languages such as Python, C++, or PERL.
- Basic knowledge of data analysis tools like JMP, Power BI, SQL, and Excel.
- Understanding of electronics components and circuit analysis.
Preferred Qualifications
- Experience with automated test equipment (ATE) and test program development.
- Strong problem-solving and prioritization skills with an independent and inquisitive mindset.
- Excellent verbal and written communication skills.
- A willingness to learn and passion for innovation in manufacturing engineering.
- Familiarity with machine learning pipelines or yield improvement practices is a plus.
Be part of a dynamic and collaborative team working at the forefront of technology. Apply your skills to solve complex challenges and help shape the future of Intel’s products.
Job Type:Experienced HireShift:Shift 1 (Malaysia)Primary Location: Malaysia, PenangAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field, plus 0–1 years of hands-on experience through internships, academic projects, coursework, or training
- Alternatively, a Master's degree in a relevant field with no prior professional experience
- Proficiency in Python, C++, or Perl
- Basic knowledge of JMP, Power BI, SQL, and Excel
- Understanding of electronic components and circuit analysis
- Experience with automated test equipment and test program development
- Strong problem-solving and prioritization skills with an independent and inquisitive mindset
- Excellent verbal and written communication skills
- Familiarity with machine learning pipelines or yield improvement practices
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
What We Do
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