Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs.
Cerebras' current customers include top model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras, to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference.
Thanks to the groundbreaking wafer-scale architecture, Cerebras Inference offers the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation.
The Role: Senior Yield Enhancement Engineer
We are seeking a highly experienced Senior VLSI Product and Test Engineer with 7+ years of relevant experience in Semiconductor Testing/Failure Analysis/Yield Enhancement. The successful candidate will look at ATE datalogs, understand the defects in detail, disposition wafers based on ATE data and drive FA/Yield enhancement using physical/optical inspection techniques used in FA.
Suitable candidate will have depth in testing, characterization of silicon defects, failure modes, and experience delivering end-to-end solutions working closely with teams across chip design, fabrication, validation, production, and manufacturing.
Key Responsibilities
- Analyze ATE data logs, Shmoo plots, parametric characterization data, and spatial wafer defect patterns.
- Develop failure analysis tools using optical, photo emission, and laser-based defect localization techniques specific to Cerebras hardware.
- Develop and execute FIB (Focused Ion Beam) edit plans for Silicon root cause validation.
- Communicating with OSATs and Fab to drive production testing in HVM environment.
- Understand DFT strategies including hierarchical scan chains, distributed BIST, SRAM test methodologies, and perform diagnosis on ATE data.
- Collaborate closely with DFT engineers, silicon architects, designers, performance teams, and software engineers to enhance overall testability and yield
- Refine test programs across di/dt behavior, voltage-frequency characterization space, current limits, and thermal constraints based on ATE logs and disposition learnings.
- Understand and write Python scripts and UNIX environment.
Required Skills & Qualifications
- Bachelor's or Master's degree in Electrical Engineering / Computer Engineering, or related field
- 7+ years of hands-on experience in semiconductor test engineering/ FA/ Yield Enhancement.
- Hands-on experience with lab debug tools including Oscilloscopes (high-speed probing and signal integrity), wafer probe stations, probe cards, Keyence/Optical inspection systems, and advanced imaging techniques.
- Failure analysis (FA) expertise including use of optical probing tools, physical inspection workflows, and correlation of electrical failures to physical defects.
- Strong capability to read and understand Digital CMOS layouts, power grids, routing structures and SRAM arrays.
- ATE test program debugging, and yield improvement experience.
- Good interpersonal skills with the ability and desire to work as a standout colleague and problem solver.
- Proven track record of working cross-functionally, learning fast, and driving issues to closure
- Working knowledge of git repositories, GitHub, git actions/Jenkins, merge and release flows to streamline test and release
- Proficiency in programming languages: Python, C/C++, Perl for large-scale data analysis
Preferred Skills
- Develop fault isolation techniques using OBIRCH/IREM/LADA optical techniques.
- Experience with advanced test data analysis tools and machine learning techniques for yield optimization.
- Familiarity with advanced packaging technologies for wafer-scale systems (TSV, advanced interconnects).
- Familiarity with in-line testing and diagnostics using CPU memory and execution with self-checking.
- Knowledge of chip defect profiles and mitigation strategies across manufacturing steps.
Location
- North America based. Sunnyvale, up to 20% travel may be needed.
The base salary range for this position is $175,000 to $250,000 annually. Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.
People who are serious about software make their own hardware. At Cerebras we have built a breakthrough architecture that is unlocking new opportunities for the AI industry. With dozens of model releases and rapid growth, we’ve reached an inflection point in our business. Members of our team tell us there are five main reasons they joined Cerebras:
- Build a breakthrough AI platform beyond the constraints of the GPU.
- Publish and open source their cutting-edge AI research.
- Work on one of the fastest AI supercomputers in the world.
- Enjoy job stability with startup vitality.
- Our simple, non-corporate work culture that respects individual beliefs.
Read our blog: Five Reasons to Join Cerebras in 2026.
Apply today and become part of the forefront of groundbreaking advancements in AI!Cerebras Systems is committed to creating an equal and diverse environment and is proud to be an equal opportunity employer. We celebrate different backgrounds, perspectives, and skills. We believe inclusive teams build better products and companies. We try every day to build a work environment that empowers people to do their best work through continuous learning, growth and support of those around them.
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Skills Required
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field
- 10+ years hands-on semiconductor test engineering experience with large-scale integration
- Proven wafer-scale testing or large parallel processor/AI accelerator testing experience
- Expert-level Advantest 93K experience (Teradyne as alternative)
- Experience with ATE test program development and optimization
- Design and implementation of DFT strategies (hierarchical scan chains, distributed BIST) including boundary scan, scan, ATPG
- Advanced interconnect testing experience (mesh networks, NoC, high-speed serial links)
- Expertise in High-Speed SerDes testing at ATE, package, and system level
- Experience handling analog blocks within large digital ASICs
- Load-board and probe-card specification, design, development, and debug
- Fault isolation techniques for defective cores/tiles and wafer-level test flows
- Production test debugging, yield improvement, and characterization (di/dt, V-F, current/temperature limits)
- Develop test strategies for wafer-scale integration-testing, redundancy, and fault tolerance verification
- Analyze spatial defect patterns and implement corrective actions
- Working knowledge of git repositories, GitHub, GitHub Actions/Jenkins, and merge/release flows
- Experience with load-board/probe-card and ATE integration for testing multiple die simultaneously
- Familiarity with high-speed memory interfaces (SRAM, DDR-DRAM, HBM)
- Good interpersonal and cross-functional collaboration skills
- Proficiency in C/C++, Python, Perl for large-scale data analysis
- Experience with advanced test data analysis tools and machine learning for yield optimization
- Familiarity with advanced packaging technologies for wafer-scale systems (TSV, advanced interconnects)
- Familiarity with in-line testing and diagnostics using CPU memory and self-checking execution
- Knowledge of chip defect profiles and mitigation strategies across manufacturing steps
Cerebras Systems Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Cerebras Systems and has not been reviewed or approved by Cerebras Systems.
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Fair & Transparent Compensation — Pay is considered competitive for an AI‑hardware firm, and many employees are described as generally happy with compensation. Sentiment indicates compensation is viewed favorably while acknowledging variation by role and seniority.
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Healthcare Strength — Health coverage is described as top quality with medical, dental, and vision included. Premiums are reportedly fully covered for employees in some plans, increasing perceived value.
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Flexible Benefits — Work‑from‑home flexibility is regarded as strong. Flexible arrangements complement standard offerings like vacation, sick leave, and paid holidays.
Cerebras Systems Insights
What We Do
Cerebras Systems is a team of pioneering computer architects, computer scientists, deep learning researchers, functional business experts and engineers of all types. We have come together to build a new class of computer to accelerate artificial intelligence work by three orders of magnitude beyond the current state of the art. The CS-2 is the fastest AI computer in existence. It contains a collection of industry firsts, including the Cerebras Wafer Scale Engine (WSE-2). The WSE-2 is the largest chip ever built. It contains 2.6 trillion transistors and covers more than 46,225 square millimeters of silicon. The largest graphics processor on the market has 54 billion transistors and covers 815 square millimeters. In artificial intelligence work, large chips process information more quickly producing answers in less time. As a result, neural networks that in the past took months to train, can now train in minutes on the Cerebras CS-2 powered by the WSE-2. Join us: https://cerebras.net/careers/
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