Job Title: Process / Quality Engineer
Pyramid Semiconductor, part of the HEICO group (www.heico.com, NYSE HEI), develops and manufactures high-reliability semiconductor products for aerospace, defense, and other mission-critical applications. Our small, experienced team works across engineering, operations, and quality to sustain trusted legacy devices and solve complex product-obsolescence challenges for our customers.
We are seeking a hands-on Process & Quality Engineer to strengthen and continuously improve our semiconductor assembly processes, with particular emphasis on die attach and wire bonding. This role is well suited to a mechanical, manufacturing, or related engineer who enjoys working directly with production equipment, operators, tooling, fixtures, and packages—and who can convert practical shop-floor knowledge into stable, documented, and repeatable processes.
Because we operate with a lean team, the engineer will also contribute to Pyramid’s quality management system, internal and external audits, corrective actions, and compliance with ISO 9001 and AS9100 requirements. The balance between process and quality work will vary with production priorities, customer programs, and the audit calendar.
Main responsibilities:
Process engineering and manufacturing support- Own and continuously improve die attach, wire bonding, and related microelectronic assembly processes.
- Develop, qualify, document, and maintain robust process parameters, work instructions, travelers, inspection criteria, and operator training materials.
- Design fixtures, tooling, workholding solutions, and mechanical package features that improve manufacturability, repeatability, quality, and operator safety.
- Provide hands-on production support by troubleshooting equipment, material, process, and workmanship issues and implementing sustainable corrective actions.
- Support and strengthen the quality management system in accordance with ISO 9001, AS9100, customer requirements, and applicable internal procedures.
- Participate in internal, customer, registrar, and other third-party audits; help prepare objective evidence, respond to findings, and verify corrective-action effectiveness.
- Lead or support root-cause investigations, nonconformance reviews, corrective and preventive actions, and continuous-improvement projects using disciplined problem-solving methods.
- Assist with risk assessments, process controls, inspection plans, supplier-quality issues, document control, training records, calibration, and configuration/change control.
Key qualifications:
- Bachelor’s degree in Mechanical Engineering, Manufacturing Engineering, Materials Engineering, Industrial Engineering, or a closely related discipline.
- Hands-on engineering experience in semiconductor packaging, microelectronics assembly, electronics manufacturing, or another precision-manufacturing environment.
- Working knowledge of die attach, wire bonding, tooling/fixture design, mechanical design, manufacturing documentation, and process troubleshooting.
- Experience using 2D/3D CAD tools and reading or creating engineering drawings; practical knowledge of dimensions, tolerances, materials, and manufacturability.
- Demonstrated ability to investigate process problems, determine root cause, implement corrective actions, and verify results with data.
- Strong written and verbal communication skills, with the ability to work effectively with operators, technicians, engineers, suppliers, auditors, customers, and management.
- Comfort working in a small-company environment where priorities can change and the engineer is expected to contribute both strategically and hands-on.
Compensation and benefits:
BCBS and Kaiser medical plans with different options
- Dental and vision plans
- 401(k) with employer match
- Sick and Vacation time
- Health Savings Account (HSA) with Company Contributions
We are committed to providing our employees with opportunities for growth and development.
Skills Required
- Bachelor's degree in Mechanical, Manufacturing, Materials, Industrial Engineering, or closely related discipline
- Hands-on engineering experience in semiconductor packaging, microelectronics assembly, electronics manufacturing, or precision manufacturing
- Working knowledge of die attach, wire bonding, tooling/fixture design, mechanical design, manufacturing documentation, and process troubleshooting
- Experience using 2D/3D CAD tools and reading or creating engineering drawings; practical knowledge of dimensions, tolerances, materials, and manufacturability
- Demonstrated ability to investigate process problems, perform root-cause analysis, implement corrective actions, and verify results with data
- Knowledge of and ability to support quality management systems, audits, and compliance with ISO 9001 and AS9100
- Strong written and verbal communication skills; ability to work effectively with operators, technicians, engineers, suppliers, auditors, customers, and management
- Comfort working in a small-company environment and contributing both strategically and hands-on
HEICO Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about HEICO and has not been reviewed or approved by HEICO.
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Retirement Support — The company maintains a long‑standing 401(k) program with company matching available to nearly all U.S. employees, with matches sometimes delivered in company stock. Official materials indicate broad participation and subsidiary‑level match structures.
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Flexible Benefits — The package spans medical, dental, vision, HSAs/FSAs, life and disability coverage, PTO and holidays, tuition reimbursement, an EAP, and various discounts, with multiple plan choices. Eligibility and specifics can differ by subsidiary.
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Wellbeing & Lifestyle Benefits — Wellness programs such as health fairs, screenings, flu shots, and on‑site classes appear alongside fitness, retail, and entertainment discounts. These offerings complement core coverage and support day‑to‑day wellbeing.
HEICO Insights
What We Do
HEICO Corporation, through its subsidiaries, engages in the design, manufacture, and sale of aerospace, defense, and electronics related products and services in the United States and internationally. The company operates through two segments, Flight Support Group (FSG/HEICO Aerospace) and Electronic Technologies Group (ETG). HEICO Aerospace offers jet engine and aircraft component replacement parts. It also involves in manufacturing specialty aircraft/defense related parts; offering thermal insulation blankets primarily for aerospace, defense, and commercial applications; subcontracting for original equipment manufacturers (OEMs); providing specialty parts as a subcontractor for aerospace and industrial OEMs, and the United States government. In addition, this segment distributes hydraulic, pneumatic, mechanical, and electro-mechanical components for the aviation markets.
