The Role and Impact
As a Process Integration and Yield Engineer, you will play a pivotal role in driving technology improvement and manufacturing excellence. You will define process integration roadmaps, analyze large volumes of structured and unstructured data, and implement solutions that enhance quality, yield, and defect reduction. Working across internal and external teams, your contributions will directly support ramping advanced packaging solutions and sustaining high-volume manufacturing processes.
Business Group
Join Intel Corporation's global team responsible for advancing technology solutions that enable high-volume manufacturing and yield improvement. This group focuses on integrating innovative processes and driving continuous improvement, ensuring Intel delivers high-quality, reliable products for customers worldwide. Be part of a collaborative environment committed to shaping the future of technology and solving complex challenges.
Key Responsibilities
- Define and establish process flows, procedures, and equipment configurations for manufacturing modules.
- Extract insights from data using statistical analysis, coding, and machine learning techniques.
- Drive yield analysis and defect reduction initiatives to support process improvement.
- Conduct quality and reliability risk assessments for manufacturing materials and process changes.
- Collaborate with cross-functional teams to ensure successful technology transfer and ramp-up activities.
- Develop monitoring systems, dashboards, and methodologies to sustain and enhance manufacturing performance.
- Lead low yield analysis and yield improvement activities in both startup and high-volume manufacturing environments.
The ideal candidate should exhibit the following behavioral traits:
- Strong troubleshooting skills and innovative problem-solving approaches.
- Excellent verbal and written communication skills.
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Microelectronics Engineering, Chemistry, Physics, or related field and 4+ year of experience.
OR
Master’s degree in the fields above with 3+ years of experience.
OR
PhD degree in the fields above with 1+ years of experience.
Experience listed above should be a combination of the following:
- Experience in semiconductor manufacturing or advanced packaging.
- Expertise in process integration, defect reduction, and backend interconnect or advanced packaging processes.
- Experience in statistical analysis tools such as JMP, SQL, and statistical process control (SPC).
- Experience with Design of Experiments (DOE) principles and Failure Mode Effects Analysis (FMEA)
Preferred Qualifications
- Experience presenting yield summaries and engaging with external foundry customers.
- Demonstrated ability to analyze defects and parametric data to drive yield improvements
- Proven track record in new semiconductor technology development and transfer.
Take the next step to advance your career by joining Intel, where you can make a meaningful impact on cutting-edge technologies that shape the future.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, New Mexico, AlbuquerqueAdditional Locations:US, Oregon, HillsboroPosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related field, plus 4 or more years of experience
- Master's degree in a listed engineering or science field, plus 3 or more years of experience
- PhD in a listed engineering or science field, plus 1 or more years of experience
- Experience in semiconductor manufacturing or advanced packaging
- Expertise in process integration, defect reduction, and backend interconnect or advanced packaging processes
- Experience with statistical analysis tools including JMP, SQL, and statistical process control
- Experience with Design of Experiments principles and Failure Mode Effects Analysis
- Experience presenting yield summaries and engaging with external foundry customers
- Ability to analyze defects and parametric data to drive yield improvements
- Track record in new semiconductor technology development and transfer
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
