General Description:
This engineering opportunity requires working within a multidisciplinary team. The candidate should feel enthusiastic about working in a class 10 cleanroom or similar lab environment daily for 80% of the time. The individual will be responsible for implementation and/or overseeing various wafer microfabrication processing steps. This includes preparing detailed and accurate work flow instruction as well as performing various levels of inspection. In addition, they will be required to learn and operate a state-of-the-art precision die bonder in a proficient manner. They will be expected to acquire sufficient understanding for executing fine-alignment D2D or D2W bonding with high yield within a 2-3 month period.
Essential Duties:
Create process flow with detailed instruction to support new technology development.
Safely handle semiconductor substrates ranging from few millimeter dies to 100mm wafers.
Wafer- and die-level inspection using a variety of inspection and metrology tools such as optical microscope, SEM, profilometer, AFM, etc.
Safely and consistently operate high accuracy semiconductor bonding tools.
Collect and organize process data, perform data analysis and present weekly summary to the team.
Clear daily communication with the project lead and the team
Required Skills:
Hands-on semiconductor wafer processing experience with silicon and/or III-V substrates. This requires sufficient knowledge of microfabrication processing steps such as photolithography, thin film deposition, dry etch, etc.
CAD and mask layout, competent in general physics as well as basic knowledge of electronic circuit theory, experience with operating high precision die bonder or similar, enthusiastic about reading and understanding scientific/engineering journals for application to assigned job duties.
Required Education:
Education: BS (minimum) or MS degree in an engineering field (electrical, mechanical, chemical or material science)
Experience: 1-3 years of microfabrication cleanroom experience
Special Requirements:
Must be a US citizen (no dual citizenship), and be willing to obtain security clearance (secret or top secret)
Compensation:
The base salary range for this full-time position $76,530 - $93,320 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.
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What the Team is Saying
What We Do
HRL Laboratories, LLC, Malibu, California, (hrl.com) pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers. As a private company owned jointly by Boeing and GM, HRL is a source of innovations that advance the state of the art in profound and far-reaching ways.
Why Work With Us
Our success is the result of our collaborative team of researchers, many of whom are the leading experts in their fields. Through their insights in support for our customers, we are finding the unique opportunities in technology.
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HRL Laboratories Offices
Hybrid Workspace
Employees engage in a combination of remote and on-site work.
Hybrid Policy is role specific.
