Jobs at HRL Laboratories

Designs, prototypes, assembles, implements, and tests mechanical solutions for advanced RF and mmWave subsystems. Responsibilities include developing electro-mechanical assemblies, programming automation and actuation components, creating technical drawings and documentation, performing tolerance analysis, applying GD&T, supporting design reviews, and collaborating with electrical and RF engineering teams. The role also involves FEA, manufacturing technology evaluation, and hands-on testing of mechanical assemblies or thermal management systems.

Designs, characterizes, and validates cryogenic mixed-signal electronics for semiconductor spin-qubit control and readout. Responsibilities include RF/microwave measurements, high-speed digital design, PCB and silicon bring-up, FPGA/ASIC verification, laboratory testing, automated test development, data analysis, and hardware debugging. The engineer collaborates with scientists and cross-functional teams to improve qubit control fidelity, signal integrity, noise performance, and system reliability.

Leads the Product Development team in transitioning laboratory prototypes into fielded hardware, firmware, and software products. Responsibilities include managing engineering staff, setting technical direction, overseeing product architecture and system integration, establishing development processes, and owning cost, schedule, and technical performance. The role also supports customer briefings, proposals, invention disclosures, and government and commercial programs, with a focus on RF, millimeter-wave, embedded, and sensor systems.

Leads multidisciplinary teams executing radar, communications, and sensing programs from R&D through production. Manages customer relationships, cost, schedule, performance, risks, proposals, capture activities, and program growth. Develops program plans and milestones, oversees execution, supports government and defense-prime customers, and mentors employees. The role requires experience with RF and photonics defense systems, systems engineering, government contracts, EVMS, proposal development, and transition from R&D to production.

Develop and lead embedded control systems for RF subsystems used in communications, radar, and electronic warfare applications. Responsibilities include low-level programming, FPGA and microcontroller development, RF system integration and testing, test automation, technical documentation, customer support, proposal contributions, mentoring junior engineers, and collaborating with scientists, engineers, program managers, and customers. The role requires approximately 20% travel and U.S. citizenship.

Leads the Firmware and Software group while contributing hands-on to embedded firmware, FPGA/SoC firmware, control software, test automation, coding, debugging, and system integration. Manages assignments, hiring, mentoring, performance feedback, development standards, CI/CD, testing, schedules, status reporting, proposals, and customer briefings. Requires expertise in C/C++, Python, HDL, FPGAs, DSPs, microcontrollers, and modern software practices, with U.S. citizenship and eligibility for a government security clearance.

Lead the design, development, qualification, and production of infrared detector packaging, cold stages, Integrated Dewar Assemblies, cryogenic hardware, and precision electromechanical systems. Perform thermal, structural, tolerance, and reliability analyses; create CAD models, drawings, specifications, bills of materials, and documentation; apply GD&T; support environmental and qualification testing; participate in customer and design reviews; and provide technical mentorship.

Leads end-to-end development of advanced phased-array radar and AESA systems from R&D through deployment. Provides system architecture, technical leadership, requirements development, trade studies, modeling, simulation, integration, testing, risk mitigation, and customer engagement. Leads multidisciplinary engineering teams, drives technical roadmaps and innovation, supports proposals, publishes technical work, and ensures compliance with military standards and customer requirements.

Designs, implements, tests, and documents high-performance RF, mmWave, and electrical subsystems. Responsibilities include schematic capture, PCB layout, fabrication oversight, module assembly, simulation, testing, thermal and mechanical integration, and adherence to manufacturing standards. The role mentors junior engineers, establishes engineering best practices, collaborates with cross-functional teams, and supports military-application hardware qualification.

Leads end-to-end development of advanced phased-array radar systems, including architecture, requirements, technical reviews, risk mitigation, integration, testing, and deployment. Provides technical leadership across hardware, software, systems integration, and test teams; drives R&D roadmaps and customer solutions. Responsibilities also include invention disclosures, technical publications, customer briefings, and proposal support.

Designs, models, integrates, and tests mechanical and thermal solutions for advanced RF subsystems. Responsibilities include FEA and SPICE simulations, SolidWorks modeling, technical drawings, GD&T, tolerance analysis, hardware integration, software support for monitoring and data acquisition, design reviews, fabrication, and qualification testing for DoD applications.

Develops advanced thermal management technologies for microelectronic, aerospace, and automotive systems. Responsibilities include designing and fabricating thermal components and microsystems, planning heat-transfer experiments and test campaigns, conducting thermal and thermo-structural modeling, collaborating with multidisciplinary teams, communicating research through presentations and publications, documenting inventions, supporting patents, and writing research proposals.

Manage government-funded R&D programs involving sensors and multidisciplinary engineering teams. Own integrated schedules, budgets, earned value, risks, suppliers, subcontractors, contractual compliance, proposals, and customer reporting. Ensure adherence to FAR/DFARS, export controls, and AS9100 requirements while guiding development-to-production transitions in aerospace and semiconductor environments.

Designs superconducting component layouts for silicon spin quantum computing using Virtuoso and related CAD tools. Develops layout automation for routing, via placement, ground-plane slotting, and metal or dielectric fill. Applies foundry constraints, RF design principles, and manufacturability requirements while collaborating with process, integration, packaging, and design teams. Troubleshoots DRC/LVS issues, supports simulations and reviews, and documents layout methodologies, automation scripts, and design rules.

Develop and validate thermal and mechanical finite element models for superconducting interposer systems operating at millikelvin to 4 K temperatures. Build CAD geometries, define material models and simulation conditions, analyze stress and deformation, and validate predictions against low-temperature measurements. Collaborate with packaging, process, and device engineering teams on design, manufacturing, reliability, and failure mitigation. Document methodologies and communicate technical findings and recommendations to engineering teams and senior management.

Lead analog and mixed-signal verification for cryogenic CMOS quantum-control circuits. Develop AMS verification strategies, behavioral models, SystemVerilog/UVM environments, assertions, regressions, and coverage methodologies. Perform transistor-level simulations, corner and Monte Carlo analysis, model correlation, DFT verification, silicon bring-up, lab debugging, and measurement validation. Automate workflows with scripting and maintain Git/Jenkins continuous integration. Collaborate across design, modeling, DFT, digital verification, and validation teams from block development through tape-out.

Designs and analyzes superconducting and non-superconducting integration components, including packages, connectors, transmission lines, and RF interconnects. Performs RF simulations of cryogenic superconducting structures, evaluates signal behavior and parasitics, and integrates foundry, materials, packaging, and test constraints into manufacturable designs. Collaborates across engineering teams, supports foundry problem-solving and process development, interprets test data, documents methodologies, and communicates technical recommendations to leadership.

Designs, fabricates, integrates, and tests RF and millimeter-wave subsystems for communications, radar, and sensing applications. Responsibilities include electronic modeling and simulation, circuit analysis, customer problem solving, invention disclosures, technical presentations, proposal support, and collaboration with scientists, engineers, program managers, and customers. The role requires familiarity with RF components, FPGAs, DSPs, microcontrollers, programming tools, and electronic test equipment, with travel of approximately 20%.

Design, integrate, and test RF and electromagnetic components and subsystems for communication, radar, and electronic warfare applications. Develop low-level embedded software and test/control software, evaluate circuit boards and PCBs, rapidly prototype with evaluation platforms, and operate RF and digital test equipment. Collaborate with scientists, engineers, customers, and program managers while supporting technical analyses, proposals, invention disclosures, publications, and customer briefings.

Designs, fabricates, integrates, and tests RF and millimeter-wave subsystems for communication, radar, and sensing applications. Collaborates with scientists, engineers, customers, and program managers; performs circuit and integrated-circuit analyses; operates electronic test equipment; develops models and simulations; prepares technical presentations and invention disclosures; supports proposals and customer problem-solving. Requires willingness to travel 20% and U.S. citizenship.