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Job Description:Job Summary
Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.
Key Responsibilities
Own and drive advanced process modules (e.g., lithography, wet/dry etch, metal/passivation deposition, wafer thinning).
Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
Drive new process integration (NPI) and process transfer to high-volume manufacturing.
Perform root cause analysis and implement robust corrective/preventive actions.
Define process control plans, SPC strategies, and OCAP execution.
Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
Mentor junior engineers and technicians.
Interface with suppliers on process and material improvements.
Qualifications
Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
8–12 years of semiconductor wafer fab process experience.
Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
Demonstrated leadership in cross-functional technical projects.
Strong analytical, problem-solving, and communication skills
Preferred
PhD in Engineering (Electrical, Chemical, Materials, or related).
Six Sigma certification (Green/Black Belt).
Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Bachelor's or Master's degree in Engineering
- 8-12 years of semiconductor wafer fab process experience
- Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools
- Demonstrated leadership in cross-functional technical projects
- Strong analytical, problem-solving, and communication skills
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
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