As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.
How You Will Contribute:
We are seeking a highly motivated Process Engineer to join our small, tightly knit team! In this role, you will play a critical part in developing and optimizing assembly processes that enable the successful production of Ciena’s cutting-edge, vertically integrated PIC (Photonic Integrated Circuit) products. Working in a collaborative environment, you will have direct interactions with managers, engineers, and technicians across multiple R&D functions, ensuring close teamwork and shared ownership of results.
Process Engineer duties and responsibilities
- Wire Bonding Development: Design and optimize wire bonding recipes for wedge bonding, ball bonding, and Cu pillar processes, including tool selection, calibration, and performance validation.
- Die Attach Process Leadership: Drive die-attach process development, including epoxy selection and recipe optimization to meet stringent reliability and performance standards.
- Reliability Testing: Conduct Highly Accelerated Stress Testing (HAST) to validate photonic component durability under extreme conditions.
- Mechanical Characterization: Perform die shear, wire pull, and die pull tests to assess bond strength and mechanical integrity.
- Quality Assurance: Develop and refine visual inspection recipes to ensure compliance with manufacturing standards and product quality.
- Cleanroom Operations: Work effectively in cleanroom environments, maintaining strict cleanliness protocols and process integrity.
- Documentation & Knowledge Sharing: Create detailed documentation of processes, recipes, and testing methods to ensure reproducibility and facilitate cross-team collaboration.
Must Haves:
- Education: Bachelor’s degree in mechanical engineering, electrical engineering, or a related field.
- Experience: 2–3 years of relevant industry experience.
- Familiarity with mechanical characterization techniques (pull test, shear test, wire bond strength analysis).
- Experience with HAST for photonic components, particularly Chip-on-Carrier (CoC).
- Data & Analysis: Ability to create test scripts for data collection and analysis.
- Strong verbal and written communication skills.
- Ability to work independently and thrive in a collaborative, team-oriented environment.
Assets:
- Proficiency in wire bonding processes (wedge bonding, Cu stud bumping, ball bonding)
- Experience in die-attach processes and pick-up tool design
- Cleanroom lab experience
Location: Ciena Ottawa, Canada – On site daily
Pay Range: The annual salary range for this position is $74,200 - $118,600
Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.
Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
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At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
Top Skills
What We Do
Ciena (NYSE: CIEN) is a global leader in networking systems, services, and software. We build the world’s most adaptive networks to enable our customers to deliver richer, more connected experiences for all users. At our core, Ciena is a company rooted in people. We prioritize deep, collaborative relationships within our teams and alongside our customers, partners, and communities around the world.
For three-plus decades, we’ve brought our humanity to our relentless pursuit of innovation. We continue to lead the evolution of networking with a strong track record of industry firsts. As end-user expectations skyrocket, our customers and their networks must transform. Ciena powers this transformation by driving next-generation solutions built for maximum openness and agility—today and into the future.
Corporate/Brand Values:
• Customer First
• Integrity
• Velocity
• Innovation
• Outstanding People
We're the perfect size for you to make an impact. W
Only Ciena has the depth of expertise and the culture of collaboration and partnership required to help our partners evolve. We do this by strategically integrating hardware, services, and software in an open environment to ensure our clients’ networks are ‘fit for flexibility’ today and into the f
Why Work With Us
We are known for our industry-firsts, including the first coherent optical solution, converged packet-optical platform, and intelligence automation platform. Our commitment extends beyond innovation, logging in over 35,000 volunteer hours and $2 million to worthy causes in 2023. We're the perfect size and culture for you to make a difference.
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