Process Engineer

We are seeking a skilled Process Engineer to manage and optimize the Wet etch and thinning processes of III-V edge-emitting lasers (EELs). The ideal candidate will be responsible for sustaining and improving existing processes, developing new methodologies, and collaborating with maintenance teams for equipment troubleshooting. Strong problem-solving abilities, effective communication skills, and a proactive approach to leading solutions are essential for success in this role.

Process Ownership :

• Lead the process development, optimization, and control of Wet Etching of GaAs/AlGaAs semiconductor material
• Lead the process development, optimization, and control of Wafer thinning processes

Process Control & Sustaining:

• Oversee and enhance complex semiconductor manufacturing processes, ensuring stability, repeatability, and yield improvements.
• Monitor control charts daily to identify and respond to process deviations.
• Track and analyze tool logs on a weekly basis to ensure optimal equipment performance.
• Monitor accessory equipment data weekly to prevent unexpected failures.
• Utilize Statistical Process Control (SPC) tools like JMP or Minitab for process monitoring and improvements.
• Lead root cause analysis (RCA) and corrective actions (4D/8D methodologies) for process failures.
• Maintain and update work instructions, standard operating procedures (SOPs), and Out-of-Control Action Plans (OCAPs) to ensure process consistency.

New Process Development & Optimization:

• Collaborate with R&D and production teams to develop and validate new semiconductor processes for III-V EEL manufacturing.
• Modify, create, and adjust process recipes for research and production improvements.
• Conduct Design of Experiments (DOE) to optimize process parameters and improve yield.
• Support Engineering Change Notices (ECNs) and process improvements to enhance manufacturability.

Equipment & Tool Management:

• Work closely with the maintenance team to troubleshoot equipment issues and improve uptime.
• Conduct Tool Qualification after Unscheduled Downtime (UDT) and Scheduled Downtime (SDT) to ensure process integrity.
• Track and analyze weekly tool logs to anticipate and mitigate performance issues.
• Assist in the installation, calibration, and qualification of new equipment to meet production standards.

Data Analysis & Reporting:

• Track and report process yield data, identifying trends and areas for improvement.
• Maintain data-driven decision-making through SPC, trend analysis, and fault detection systems.
• Collect and analyze scrap/hold information, supporting senior engineers in resolving process deviations.
• Provide technical reports and updates to stakeholders/manager, ensuring transparency in process performance.

Experience:

• 3+ years of hands-on experience in semiconductor manufacturing, preferably with III-V materials.
• Prior experience as a process owner in high-volume manufacturing is required.
• Experience in Wet Etching and Wafer Thinning is required.
• Experience in Photolithography and Thin Film Deposition is highly desired.
• Proficiency in SAS JMP, Minitab, or other statistical analysis software is a plus.
• Strong knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), Six Sigma methodologies, and problem-solving techniques is highly desirable.

Education:

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemistry, or a related field.

Key Competencies:

• Strong analytical and problem-solving skills to drive process improvements.
• Excellent communication and teamwork skills for cross-functional collaboration.
• Proactive and detail-oriented approach to identifying and resolving process inefficiencies.
• Ability to work independently and take ownership of process control and optimization.
• Passion for semiconductor technology and continuous process enhancement.

TRUMPF is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability, veteran status, or other protected class.

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