Process Engineer

•Responsible for supporting New Package development of processes in automotive applications.

•Responsible for quality, yield, cost and process improvement activities.

•Responsible for process documentation, process spec, standard work instruction, OCAP, Lead  etc.

•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.

•Take ownership to work closely with upper management to align scope and direction of key projects.

Qualification

•Candidate must possess at least a Bachelor's Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).

•1-2 years of work experience with semiconductor assembly background for automotive customers.

•Experience in MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.

•Good technical knowledge and hands-on experience in semiconductor manufacturing processes, such as saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.

•Candidate must have great interpersonal skills, leadership skills, positive minded, self-driven and eager to strive for success.

•Good SPC, Process Control and other relevant statistical & problem-solving skills

Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project management knowledge is an added advantage.

More information about NXP in Malaysia...

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