Process Engineer

Posted 3 Days Ago
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Hiring Remotely in Bangkok, Phra Nakhon, Bangkok, THA
Remote
Mid level
Automotive • Internet of Things • Mobile • Semiconductor • Industrial
The Role
Optimize semiconductor wafer saw, backgrind, and DBG processes for production. Responsibilities include developing SOPs and operator training, leading root cause analysis for defects and yield losses, dispositioning quality issues, supporting new product introduction and process qualification, analyzing production data, collaborating on cost reduction and improvement projects, and managing process changes and material qualifications.
Summary Generated by Built In

Job Summary:

Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.

Job Responsibility

  • Define/optimize procedures to ensure smooth processing of production lots
  • Develop and maintain process documentation and SOPs including operator training
  • Lead root cause analysis for defects and yield losses
  • Provide disposition on lots with quality issues
  • Support new product introduction and process qualification
  • Analyze production data to identify process improvements
  • Collaborate with cross-functional teams on cost reduction and process improvement projects
  • Perform change management including new material qualification

Qualification

  • Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
  • 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
  • Strong data analysis and problem-solving skills.
  • Experience with Statistical Process Control (SPC) and process validation (preferred).
  • With good command of English language.
  • Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).

 

More information about NXP in Thailand...

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Skills Required

  • Bachelor's or master's degree in Engineering, such as Electronics, Industrial, Chemical, Mechanical, or a related field
  • 3-5 years of semiconductor process engineering experience with backgrind and dicing before grinding (DBG) processes
  • Strong data analysis and problem-solving skills
  • Good command of the English language
  • Experience with Statistical Process Control (SPC) and process validation
  • Knowledge of Lean, Six Sigma, or continuous improvement tools
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The Company
HQ: Eindhoven
21,993 Employees
Year Founded: 2006

What We Do

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA

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