Cadence Design Systems Inc. is looking for a motivated Principal Solutions Engineer: Allegro Package Designer to work with us in Belo Horizonte, Brazil for the Allegro Team. Cadence has been nominated as a Great Place to Work globally and in Brazil, and is also a Fortune 100 Best Companies to Work For.
This position involves delivering advanced packaging and 3DIC implementation flows for foundry and customer solutions primarily using Cadence Allegro Package Designer (APD).
Job Description:
- Work in a team environment creating and implementing 3DIC reference flows and designs.
- Use Allegro Package Designer (APD) with experience routing laminates and RDL designs, coding technology files, creating rules and constraints, handling Ravel coding for 3D rules, and implementing bond wires, bumps and 3D structures and designs.
- Use Allegro SKILL for scripting and automation.
- Experience with creating Virtuoso-ready APD package files a must.
- Expertise with packaging formats, including GDS, Gerber, IPC and DXF, both for import and export.
Requirements:
- Complete Bachelor’s degree in Electrical or Electronics Engineering
- Experience with package design and APD
- Strong knowledge of advanced packaging concepts
- Strong knowledge of 2.5D, 3DIC and stacked die technologies
- Good programming knowledge with Allegro Skill and Ravel a plus
- Strong customer-facing communication and problem-solving skills
- Strong personal drive for continuous learning and expanding professional skill sets
- Excellent verbal and written communication skills
Employment category: CLT.
Employment term: 40 hours/week.
Competitive benefits.
Location: Av Contorno 5800, Belo Horizonte, Minas Gerais, Brazil.
Cadence is the only company that provides the expertise and tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live, work, and play. Our products are used in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments.
For more information, access http://www.cadence.com
We’re doing work that matters. Help us solve what others can’t.Skills Required
- Bachelor's degree in Electrical or Electronics Engineering
- Minimum 10 years experience with package design
- Minimum 2 years experience with APD
- Strong knowledge of advanced packaging concepts
- Strong knowledge of 2.5D, 3DIC and stacked die technologies
- Good programming knowledge with Allegro Skill and Ravel
- Strong customer-facing communication and problem-solving skills
- Strong personal drive for continuous learning
- Excellent verbal and written communication skills
What We Do
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and IP are used by customers to deliver products to market faster. The company's Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For.
