Principal System/Rack Mechanical Engineer

Location: Research Triangle Park (RTP), North Carolina
Department: Hardware Engineering / System Architecture
Employment Type: Full-Time

We are seeking a Senior Principal Mechanical Engineer to lead mechanical architecture and system integration across next-generation AI platforms, optical networking systems, and rack-scale infrastructure solutions.

This is a highly visible leadership role responsible for developing mechanical architecture across:

• PCIe Scale-Up AI Infrastructure
• UALink Rack-Scale Fabrics
• Ethernet Scale-Out Systems
• ESUN Network Architectures
• GPU Compute Platforms
• Open Rack Systems
• Fiber Connectivity Infrastructure
• NPO (Near Package Optics)
• CPO (Co-Packaged Optics)
• Air-Cooled and Liquid-Cooled AI Platforms

You will work closely with Thermal, Power, Electrical, Silicon, Software, and System Architecture teams, as well as ODM partners including Accton, Hyve, Wistron, Quanta, and Gigabyte.

• Define mechanical architecture from device-level products through complete rack-scale AI systems.
• Develop scalable mechanical designs supporting future generations of AI infrastructure.
• Establish system-level design requirements balancing:
  • Performance
  • Reliability
  • Manufacturability
  • Serviceability
  • Cost
  • Sustainability

Own mechanical architecture for:

• GPU Compute Platforms
• PCIe Scale-Up Switch Platforms
• UALink Switch Platforms
• Optical Connectivity Systems
• Rack Controllers
• Rack Enclosures
• Cable Management Systems
• Open Rack Platforms

Drive solutions that support high-density AI computing deployments.

• Define rack layouts and mechanical interfaces.
• Develop scalable rack architecture standards.
• Drive mechanical integration of:
  • Compute systems
  • Switch platforms
  • Power shelves
  • Cooling infrastructure
  • Optical connectivity
  • Management systems
• Support future multi-rack AI factory deployments.

Develop mechanical solutions supporting:

• Fiber Infrastructure
• Optical Engines
• Silicon Photonics
• NPO Architectures
• CPO Architectures
• Rack-to-Rack Optical Connectivity

Address challenges associated with:

• Cable routing
• Bend radius management
• Serviceability
• Fiber protection
• Field replaceability

Partner with Thermal Engineering teams to:

• Optimize airflow architecture.
• Develop liquid cooling mechanical solutions.
• Support cold plate integration.
• Define coolant distribution infrastructure.
• Improve overall system cooling efficiency.

• Define manufacturing-ready mechanical solutions.
• Support supplier and ODM engagement.
• Drive cost optimization efforts.
• Establish assembly and service procedures.
• Improve production scalability and operational efficiency.

Work closely with:

• Electrical Engineering
• Thermal Engineering
• Power Architecture
• Silicon Development
• Product Management
• Manufacturing Teams

to ensure complete system integration and design alignment.

Work directly with Accton, Hyve, Wistron, Quanta, Gigabyte, and other ODMs to:

• Define mechanical requirements.
• Review platform designs.
• Resolve integration challenges.
• Drive Open Rack implementation.
• Support design validation and manufacturing readiness.

• Bachelor's, Master's, or PhD in Mechanical Engineering or related discipline.
• 15+ years of experience in mechanical design and system integration.
• Proven experience leading mechanical architecture for:
  • Servers
  • Networking Platforms
  • Storage Systems
  • AI Infrastructure
  • Data Center Hardware
• Expertise in:
  • Sheet Metal Design
  • Structural Analysis
  • Tolerance Analysis
  • Mechanical Packaging
  • Cable Management
  • System Integration
  • Design for Manufacturing (DFM)
  • Design for Assembly (DFA)

• Experience with Open Rack and OCP architectures.
• Experience supporting rack-scale AI infrastructure.
• Familiarity with PCIe Scale-Up and UALink architectures.
• Experience with Ethernet and optical networking systems.
• Knowledge of fiber connectivity solutions and optical packaging.
• Experience supporting NPO and CPO platforms.
• Experience developing liquid-cooled infrastructure.
• Experience working directly with ODM/JDM manufacturing partners.

The ideal candidate will demonstrate:

• Strong systems thinking
• Strategic technical leadership
• Cross-functional influence
• Excellent communication skills
• Ability to drive architecture decisions across multiple organizations
• Passion for solving complex AI infrastructure challenges

You will help define the mechanical architecture for next-generation technologies including:

• PCIe Scale-Up AI Fabrics
• UALink Scale-Up Networks
• Ethernet Scale-Out Infrastructure
• ESUN Network Architectures
• NPO and CPO Optical Platforms
• Advanced Fiber Connectivity Solutions
• Open Rack AI Systems
• Future AI Factory Deployments

This is an opportunity to drive the mechanical design of industry-leading products that power the world's largest AI clusters.

If you are passionate about mechanical innovation, rack-scale infrastructure, optical connectivity, and next-generation AI systems, we'd love to hear from you.

The salary range is $170,000 to $210,000, depending on experience, level, and business needs. This role may be eligible for discretionary bonuses, incentives, and benefits.

Join us in Research Triangle Park and help build the future of AI infrastructure.