Principal SoC Chip Lead

Posted 2 Months Ago
Be an Early Applicant
2 Locations
In-Office
Senior level
Automotive • Internet of Things • Mobile • Semiconductor • Industrial
The Role
Lead end-to-end SoC program execution from definition through tape-out and post-silicon support. Provide technical leadership across architecture, RTL, verification, implementation, physical design, and validation teams. Coordinate cross-functional teams, manage project schedules, risks, and resources, and drive stakeholder communication and tape-out readiness. Support silicon bring-up, debug, and post-silicon validation to ensure timely, high-quality delivery.
Summary Generated by Built In

Responsibilities:

  • End-to-End Project Ownership: Own SoC program execution from project definition through tape-out and post-silicon support. Ensure on-time, high-quality delivery of key milestones and coordinate engineering support during silicon bring-up, validation, and debug.
  • Technical Leadership: Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams. Serve as the overall technical execution owner for assigned projects.
  • Cross-Functional Coordination: Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams. Resolve technical dependencies, execution bottlenecks, and critical project risks.
  • Program Execution & Risk Management: Develop and maintain project execution plans together with PMO and SoC PM. Monitor schedule, resource demand, critical paths, and risk mitigation plans; drive recovery actions when milestones are at risk.
  • Stakeholder Management: Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders. Communicate project status, technical readiness, key risks, and mitigation plans during management and milestone reviews.
  • Tape-Out & Silicon Readiness: Own overall tape-out readiness, including integration quality, signoff closure, cross-functional alignment, and risk management. Coordinate post-silicon validation activities and engineering resources to support silicon bring-up and issue resolution.

Requirements:

  • Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines.
  • 6+ years of semiconductor industry experience.
  • Proven experience in SoC development from architecture through tape-out.
  • Strong understanding of SoC development flows including: Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation.
  • Experience leading large cross-functional engineering teams.
  • Strong project execution, planning, and risk management skills.
  • Excellent communication, leadership, and stakeholder management capabilities.
  • Ability to influence technical direction and drive execution in a matrix organization.

Preferred Qualifications:

  • Previous experience as: Chip Lead / SoC Technical Lead / Chief Engineer / Project Technical Leader
  • Experience with automotive, industrial, or safety-critical semiconductor products.
  • Experience working with global development teams across multiple sites.
  • Successful delivery of multiple SoC tape-outs and post-silicon product ramps.

Core Competencies:

  • Technical Leadership
  • Cross-functional Collaboration
  • Project Execution Excellence
  • Risk Management
  • Strategic Thinking
  • Problem Solving & Decision Making
  • Stakeholder Management
  • Communication & Influence
  • Customer Focus
  • Results Orientation


More information about NXP in Greater China...

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Skills Required

  • Bachelor's degree or higher in Microelectronics, Electrical Engineering, or related disciplines
  • 6+ years of semiconductor industry experience
  • Proven experience in SoC development from architecture through tape-out
  • Strong understanding of SoC development flows including Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, Silicon Validation
  • Experience leading large cross-functional engineering teams
  • Strong project execution, planning, and risk management skills
  • Excellent communication, leadership, and stakeholder management capabilities
  • Ability to influence technical direction and drive execution in a matrix organization
  • Previous experience as Chip Lead, SoC Technical Lead, Chief Engineer, or Project Technical Leader
  • Experience with automotive, industrial, or safety-critical semiconductor products
  • Experience working with global development teams across multiple sites
  • Successful delivery of multiple SoC tape-outs and post-silicon product ramps
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The Company
HQ: Eindhoven
21,993 Employees
Year Founded: 2006

What We Do

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA

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