The Principal Process Integration Engineer is responsible for ensuring the quality, reliability, and yield of InP-based Photonic Integrated Circuit (PIC) products. This role plays a key part in ramping high-volume production and works cross-functionally to troubleshoot and optimize wafer fabrication processes, resolve yield issues, and support next-generation PIC platform development.
Responsibilities· Own wafer quality and yield using deep knowledge of fab processes, device physics, and test/reliability data
· Analyze process deviations and test failures to identify root causes and implement corrective actions
· Establish, maintain, and monitor inline fab process specifications and capability (CPK)
· Drive yield improvement initiatives from concept through qualification and production release
· Define design rules and develop test structures for effective process control
· Support technology development, transfer, and manufacturing ramp for next-generation PIC platforms
· Partner with Process Engineering to improve process stability and capability
· Collaborate with Operations to improve throughput and reduce cycle time
Qualifications· MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field
· 10+ years of experience in semiconductor wafer fabrication
· Hands-on experience with III-V processes, including epitaxy, wet and dry etching, photolithography, and metal deposition
· Strong understanding of semiconductor processes and device physics
· Proven analytical and problem-solving skills with proficiency in data analysis tools (e.g., JMP, Python)
· Experience with SPC, DOE, and yield optimization methodologies
· Excellent communication skills with the ability to present technical work to diverse stakeholders
Skills Required
- MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field
- 10+ years of experience in semiconductor wafer fabrication
- Hands-on experience with III-V processes, including epitaxy, wet and dry etching, photolithography, and metal deposition
- Strong understanding of semiconductor processes and device physics
- Proven analytical and problem-solving skills with proficiency in data analysis tools such as JMP or Python
- Experience with SPC, DOE, and yield optimization methodologies
- Excellent communication skills and ability to present technical work to diverse stakeholders
Nokia Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Nokia and has not been reviewed or approved by Nokia.
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Equity Value & Accessibility — Equity programs include a global employee share purchase plan with company matching and multi‑year share awards. These mechanisms broaden participation and tie rewards to long‑term outcomes.
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Healthcare Strength — Health coverage includes major medical plans with supplementary options such as vision, legal services, and care navigation. The range of offerings indicates comprehensive support for medical needs.
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Parental & Family Support — A global policy grants paid leave for new parents regardless of gender and provides structured return‑to‑work support. Company‑paid life insurance further strengthens family protection across regions.
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What We Do
At Nokia, we create technology that helps the world act together. As a trusted partner for critical networks, we are committed to innovation and technology leadership across mobile, fixed and cloud networks. We create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs. Adhering to the highest standards of integrity and security, we help build the capabilities needed for a more productive, sustainable and inclusive world.
