Principal PCB - Package co-design Architect

Posted Yesterday
Be an Early Applicant
Chandler, AZ, USA
Hybrid
250K-338K Annually
Expert/Leader
Artificial Intelligence • Internet of Things • Semiconductor
Build What the World Depends On
The Role
Lead PCB and silicon-package co-design for Arm SoC-based hardware platforms. Specify and evaluate PCB/package integration, routing strategies, stack-up and manufacturability, perform SI/PI and escape-routing analysis, influence SoC pinouts, support early silicon and board architecture, and collaborate across global teams and fabricators to deliver optimal, cost-effective platform solutions.
Summary Generated by Built In
Would you like to help craft Arm's next generation of hardware platforms and solutions? We seek an experienced Electronics Engineer specializing in PCB Silicon packaging co-design and system-level hardware architect to join Arm's Packaging, Boards and Multiphysics team. You will work with the wider business, collaborating with the SoC teams, architects and platform leads to help define, influence and align technical requirements and features. Assess design trade-offs to develop the most optimal solution for our customers and development partners.
The team works at the forefront of embedded compute, focusing on prototyping Arm's latest IP products, to build physical hardware development platforms based around custom Arm SoC.
Responsibilities:
Collaborate with engineering groups spanning multiple geographies to specify, evaluate, analyze and develop solutions for efficient PCB and silicon package integration. Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout, routing strategies, design rules and layer optimization to ensure optimal performance, reliability, and cost-effectiveness. Engage with technical leads and SoC development teams to translate technology requirements into platform architectures. Communicate technical concepts clearly and credibly across audiences ranging from Silicon and Packaging architecture to technology leads. Provide timescale estimates and justifications into the program team.
Required Skills and Experience:
  • Deep technical background and understanding of SoC architectures and platforms involving high-performance embedded compute, Cloud/Edge AI, IoT space
  • Experience with various high-speed IO interface standards (e.g. PCIe Gen5/6/7, LPDDR5/6, CSI, DSI) and peripherals for embedded storage and compute systems.
  • Competence with embedded system board design, with complex LSI devices such as FPGAs and embedded firmware and power management ICs (PMICs)
  • Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery.
  • Experience of collaborating with chip packaging teams. Ability to influence and drive SoC device pin-outs for cost optimization, routing feasibility and layer trade-off analysis.
  • Expertise in escape routing analysis of high density SoC's and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
  • Extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
  • Understanding of the PCB fabrication process (PTH and HDI), stackup/VIA topologies and substrate materials. Ability to collaborate with PCB fabricators and CEM partners to assess manufacturability of advanced PCB technologies.
  • Evaluate package pinout options against PCB routability, SI/PI performance, layer count, manufacturability, and cost. Ability to define or review PCB layout guidelines and constraints.
  • Support early silicon and board architecture definition, including component placement, form-factor constraints, PDN strategy, and routing feasibility.
  • Proficiency in the use of EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro)
  • Skilled in exchanging information and maintaining positive work relationships. Positive can-do attitude and attention to detail.
  • Ability to work optimally in a fast-paced environment with changing priorities and requirements; drive progress in an ambiguous environment with evolving needs

Desirable Skills and Qualities
  • Experience in using Signal Integrity tools from ANSYS, Siemens EDA etc.
  • Fundamental understanding of compute architectures and functional building blocks
  • Experience working within the semi-conductor industry
  • Enjoy collaborating and working in across geographies with multiple teams.

In Return:
You will gain a deeper understanding of system architecture and high-performance compute platforms! Work alongside other engineering teams across the business, collaborating and enabling architects, engineers and designers. You will enjoy new technical challenges faced when using advancing technologies! We offer an outstanding opportunity to join Arm at a time of exciting growth and development.
Salary Range:
$249,900-$338,100 per year
We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.
Accommodations at Arm
At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [email protected] . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.
Hybrid Working at Arm
Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team's needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.
Equal Opportunities at Arm
Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don't discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.

Skills Required

  • Deep technical background in SoC architectures and high-performance embedded compute platforms
  • Experience with high-speed IO standards (PCIe Gen5/6/7, LPDDR5/6, CSI, DSI)
  • Competence in embedded system board design with complex LSI devices and FPGAs
  • Experience with embedded firmware and power management ICs (PMICs)
  • Familiarity with IC packaging technologies and their impact on PCB design
  • Experience collaborating with chip packaging teams and influencing SoC pin-outs
  • Expertise in escape routing analysis for high-density SoCs and estimating routable IO counts
  • Extensive Signal and Power Integrity (SI/PI) analysis knowledge from board and packaging perspectives
  • Understanding of PCB fabrication processes, stackup/VIA topologies, PTH and HDI, and substrate materials
  • Ability to evaluate package pinout options against routability, SI/PI, layer count, manufacturability, and cost
  • Support board architecture definition including component placement, PDN strategy, and routing feasibility
  • Proficiency with EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro)
  • Strong communication and collaboration skills; attention to detail and positive attitude
  • Ability to work effectively in a fast-paced, ambiguous environment and drive progress
  • Experience using Signal Integrity tools (ANSYS, Siemens EDA)
  • Fundamental understanding of compute architectures and functional building blocks
  • Experience working within the semiconductor industry and across geographies

Arm Compensation & Benefits Highlights

  • Equity Value & Accessibility Broad RSU grants are positioned as a core part of total rewards post‑IPO, and a 2024 ESPP allows up to a 15% discount with lookback to the lower of the start or purchase‑date price. Together these programs expand ownership opportunities across the workforce.
  • Retirement Support Investor filings state a 401(k) match of 100% up to the first 6% of employee contributions, with the same match rate cited for executives and the wider workforce. This signals strong employer support for long‑term savings.
  • Leave & Time Off Breadth Benefits include a fully paid four‑week sabbatical after four years, enhanced maternity/paternity and parental bonding leave, a quarterly Day of Care, and paid volunteering time. These offerings indicate breadth well beyond standard PTO.

Arm Insights

Am I A Good Fit?
beta
Get Personalized Job Insights.
Our AI-powered fit analysis compares your resume with a job listing so you know if your skills & experience align.

The Company
HQ: Cambridge, England
8,314 Employees
Year Founded: 1990

What We Do

We bring brilliant people together in a global ecosystem that is sparking the world’s potential. Arm technology enables specialized processing built on the economics, design freedom and accessibility of general-purpose compute that has, so far, led to more than 180 billion chips being shipped by our partners.

Why Work With Us

At Arm, we build the future of computing, powering everything from smartphones to AI. Our 10x mindset drives bold thinking and deep collaboration to solve complex problems together. With a people first culture, flexible work, and strong support for growth and wellbeing, your ideas can make a global impact while your career thrives.

Gallery

Gallery
Gallery
Gallery
Gallery

Arm Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Typical time on-site: Not Specified
HQCambridge, UK
Galway, Ireland
Budapest, Hungary
Sophia Antipolis, France
Ra'anana, Israel
Bengaluru, India
Noida, India
Yokohama, Japan
Seoul, South Korea
Hsinchu, Taiwan
Taipei, Taiwan
Munich, Germany
Austin, TX
Bristol, UK
Chandler, AZ
Raleigh, NC
Lund, Sweden
Manchester, England
Oslo, Norway
San Diego, CA
San Jose, CA
Sheffield, UK
Trondheim, Norway
Boston, MA
Learn more

Similar Jobs

Arm Logo Arm

Design Engineer

Artificial Intelligence • Internet of Things • Semiconductor
Hybrid
Chandler, AZ, USA
8314 Employees
198K-268K Annually

Arm Logo Arm

Team Lead

Artificial Intelligence • Internet of Things • Semiconductor
Hybrid
3 Locations
8314 Employees
243K-314K Annually

Arm Logo Arm

Staff Signal and Power Integrity Engineer

Artificial Intelligence • Internet of Things • Semiconductor
Hybrid
Chandler, AZ, USA
8314 Employees
198K-268K Annually

Arm Logo Arm

Staff Power Integrity Engineer

Artificial Intelligence • Internet of Things • Semiconductor
Hybrid
Chandler, AZ, USA
8314 Employees
198K-268K Annually

Sign up now Access later

Create Free Account

Please log in or sign up to report this job.

Create Free Account