Principal Device/Process Integration Engineer

We are looking for Device / Process Integration Engineer role in preparation for the formation of the joint venture of NXP and VIS, known as VSMC.

Job Description

This posting is for a Device/Process Integration engineer in a high volume, 300mm wafer manufacturing environment.  This position requires product/part ownership from starting substrate through wafer test. This includes sustaining, disposition, troubleshooting, yield enhancement, and New Product Introduction.  Candidate must have a strong technical background in semiconductor device physics and process integration.  Candidate must also exhibit good planning, organizational, teamwork and communication skills. 

Primary Responsibilities:

• Working closely with Product Engineering teams to quickly introduce new products into manufacturing.
• Drive yield and cost benefits on existing products through process integration enhancements, defect reduction, and product performance improvements.
• Monitor electrical device operation to assure conformance to quality standards and engineering specifications.
• Lead and support cross functional teams within the factory to improve manufacturing efficiencies, product quality, and contain/resolve factory excursions as well as customer returns.
• Collaborate with Manufacturing, Maintenance, and Process teams to improve overall performance.
• Demonstrate strong verbal and written communication skills with the ability to summarize complex technical issues in an easy to convey format.  Must be comfortable presenting issues and solutions to cross functional audiences.
• Provide innovative, real time, quick response, and solutions to operational issues to help maintain manufacturing requirements while maintaining the highest level of quality.
• Mentor engineers and provide technical leadership in process improvement.

Required Skills/Experience:

• BS degree required, ideally in Electrical or Chemical engineering or similar science-based degree. MS preferred.
• Minimum 15 years’ experience in a device or process engineering capacity or other similar technical experience preferred.
• Experience in copper metallization technologies preferred.
• Strong background in DOE and SPC.  Six Sigma Green Belt preferred.
• Experience in Design of Experiments and Statistical Process Control. 
• Working knowledge of Excel, JMP, Word, and PowerPoint required.
• Strong data analysis, troubleshooting, teamwork, and communication skills.
• Ability to successfully plan, execute, analyze, and deliver projects per schedule.

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