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The Role
Leads signal and power integrity engineering for Intel platform, board, and package designs. Responsibilities include electrical architecture, high-speed interface implementation, schematic and PCB layout reviews, SI/PI simulation, routing guideline development, laboratory validation, debugging, root-cause analysis, and compliance testing. The role provides technical leadership across silicon, package, firmware, manufacturing, and validation teams while mentoring engineers and driving design standards for interfaces such as DDR, PCIe, USB4, Ethernet, CXL, and high-speed SerDes.
Summary Generated by Built In
Job Details:Job Description: Job summary
The Platform Signal/Power Integrity (SI/PI) Engineer Lead is responsible for defining, developing, and delivering Signal Integrity and Power Integrity solutions for Intel next-generation validation and product platforms. The role provides technical leadership in platform electrical architecture, high-speed interface implementation, schematic design, PCB layout review, routing guideline development, simulation, validation, and debugging activities.
The successful candidate will collaborate closely with silicon, package, platform design, PCB layout, firmware, validation, and manufacturing teams to ensure high-performance, robust, and reliable platform designs that meet electrical, timing, signal quality, and power delivery requirements.
Key Responsibilities:
• Lead Signal Integrity and Power Integrity activities for complex platform, board, and package designs.
• Perform pre-layout and post-layout SI/PI simulations and analysis.
• Analyze and optimize:
Channel loss
Reflection
Crosstalk
Jitter
Timing margin
Power delivery network (PDN) performance
Power noise and voltage droop
• Develop electrical budgets and design margin requirements for high-speed interfaces.
• Correlate simulation results with laboratory measurements and validation data.
• Drive platform electrical architecture and implementation reviews.
• Perform schematic capture and detailed schematic reviews for complex validation and production platforms.
• Review power architecture, voltage regulator implementation, termination schemes, and interface connectivity.
• Define stack-up, impedance, return path, and power distribution requirements.
• Ensure compliance with platform electrical specifications and design targets.
• Develop and maintain PCB design guidelines and routing constraints.
• Define routing requirements for high-speed interfaces including:
DDR4/DDR5
PCIe Gen4/Gen5/Gen6
USB4/Thunderbolt
Ethernet
CXL
High-speed SerDes links
• Conduct PCB layout reviews and provide sign-off recommendations.
• Drive implementation reviews for:
Length matching
Differential pair routing
Reference plane transitions
Via optimization
Return path continuity
Decoupling placement
EMI-sensitive routing practices
• Work closely with PCB layout engineers and board vendors to resolve implementation issues.
• Generate and maintain platform SI/PI design guidelines.
• Develop interface-specific routing recommendations and implementation specifications.
• Document design rules, characterization reports, simulation methodologies, and lessons learned.
• Create customer-facing and internal SI/PI collateral supporting platform development and deployment.
• Develop validation methodologies and compliance testing plans.
• Perform electrical characterization and measurements using:
Oscilloscopes
Vector Network Analyzers (VNA)
TDR/TDT equipment
Logic analyzers
Protocol analyzers
• Debug signal integrity, timing, and power delivery failures.
• Lead root-cause analysis and corrective action activities during board bring-up and validation.
• Lead SI/PI reviews across multiple platform programs.
• Mentor engineers in SI/PI methodology, PCB design practices, and debugging techniques.
• Drive best practices and continuous improvement initiatives.
• Provide technical leadership across platform, silicon, package, and validation organizations.Qualifications:Minimum Qualifications
• Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field.
• 9+ years of experience in Signal Integrity, Power Integrity, Platform Hardware Design, or Board Design.
• Strong understanding of high-speed digital design and power delivery architectures.
• Experience with high-speed PCB design and implementation.
• Hands-on experience performing schematic review and board-level electrical analysis.
• Knowledge of transmission line theory, channel modeling, termination techniques, and power distribution network analysis.
• Strong understanding of SI/PI fundamentals, including:
Crosstalk
Reflection
Jitter
Eye diagram analysis
S-Parameters
Power noise
Voltage droop
• Proven debugging and root-cause analysis skills.
• Excellent communication and cross-functional collaboration skills.
Preferred Qualifications
SI/PI Tools
• Experience with:
Cadence Sigrity
Cadence Allegro
Ansys HFSS
Ansys SIwave
ADS
SPICE-based simulation tools
Power-aware SI/PI simulation tools
Platform Design Experience
• Experience reviewing and signing off:
Schematics
PCB layouts
Routing constraints
SI/PI compliance requirements
• Experience defining routing guidelines and electrical design rules for high-speed interfaces.
• Familiarity with package-board co-design methodologies.
• Knowledge of DFM, DFT, and reliability considerations.
Interface Expertise
Demonstrated experience with one or more of:
• DDR4 / DDR5
• LPDDR4 / LPDDR5
• PCIe Gen4 / Gen5 / Gen6
• USB4 / Thunderbolt
• Ethernet
• SATA
• CXL
• UCIe
• High-speed SerDes technologies
Job Type:Experienced HireShift:Shift 1 (Malaysia)Primary Location: Malaysia, PenangAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field
- 9+ years of experience in Signal Integrity, Power Integrity, Platform Hardware Design, or Board Design
- Strong understanding of high-speed digital design and power delivery architectures
- Experience with high-speed PCB design and implementation
- Hands-on experience performing schematic review and board-level electrical analysis
- Knowledge of transmission line theory, channel modeling, termination techniques, and power distribution network analysis
- Strong understanding of SI/PI fundamentals, including crosstalk, reflection, jitter, eye diagram analysis, S-parameters, power noise, and voltage droop
- Proven debugging and root-cause analysis skills
- Excellent communication and cross-functional collaboration skills
- Experience with Cadence Sigrity, Cadence Allegro, Ansys HFSS, Ansys SIwave, ADS, SPICE-based simulation tools, or power-aware SI/PI simulation tools
- Experience reviewing and signing off schematics, PCB layouts, routing constraints, and SI/PI compliance requirements
- Experience defining routing guidelines and electrical design rules for high-speed interfaces
- Familiarity with package-board co-design methodologies
- Knowledge of DFM, DFT, and reliability considerations
- Demonstrated experience with DDR4, DDR5, LPDDR4, LPDDR5, PCIe Gen4, PCIe Gen5, PCIe Gen6, USB4, Thunderbolt, Ethernet, SATA, CXL, UCIe, or high-speed SerDes technologies
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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