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The Role
Designs and leads complex platform hardware solutions from architecture and schematic capture through PCB implementation, board bring-up, validation, and debugging. Responsibilities include high-speed interface design, signal and power integrity analysis, routing and stack-up definition, design reviews, laboratory testing, issue resolution, and collaboration with cross-functional engineering and manufacturing teams. The role also develops design guidelines, mentors engineers, and drives improvements in hardware development methodologies.
Summary Generated by Built In
Job Details:Job Description: Job Description :
Designs, develops, and delivers complex platform hardware solutions for Intel validation and product development platforms. Translates system and platform requirements into board-level electrical designs and drives implementation from architecture definition through board bring-up, validation, and debug.
Responsible for leading the design and development of high-speed printed circuit boards (PCB), subsystems, and platform solutions while ensuring compliance with electrical, mechanical, thermal, manufacturability, and cost objectives.
Key responsibilities include:
• Independently design and develop complex platform hardware solutions including schematic capture, component selection, board-level architecture, and subsystem integration.
• Translate platform requirements into detailed electrical specifications, schematics, placement constraints, routing requirements, and implementation guidelines.
• Develop and review high-speed interface implementations including DDR, PCIe, USB, Ethernet, CXL, and other high-speed communication interfaces.
• Define PCB stack-up requirements, impedance control strategies, return path optimization, power delivery implementation, and routing constraints.
• Review and approve schematics, component selections, and board-level implementations to ensure compliance with platform electrical requirements.
• Conduct PCB layout and routing reviews, providing recommendations to improve signal integrity, power integrity, manufacturability, and overall design quality.
• Generate and maintain platform design guidelines, routing rules, electrical specifications, and implementation best practices.
• Perform system-level electrical analysis including Signal Integrity (SI), Power Integrity (PI), timing analysis, and design margin assessments.
• Collaborate with PCB layout engineers, package engineers, architects, firmware developers, validation teams, and manufacturing partners to ensure successful platform implementation.
• Lead board bring-up, electrical validation, root cause analysis, and debugging activities using advanced lab equipment.
• Drive issue resolution for complex hardware problems and recommend corrective actions.
• Mentor junior engineers and provide technical guidance during design reviews and debug activities.
• Contribute to continuous improvement of platform design methodologies, validation processes, and engineering best practices.
The ideal candidate should exhibit the following behavioral traits:
• Strong technical leadership and problem-solving abilities.
• Excellent verbal and written communication skills.
• Ability to drive technical discussions and influence design decisions.
• Demonstrated ownership and accountability for project execution.
• Ability to work effectively across global cross-functional teams.
• Self-motivated with strong attention to detail and commitment to engineering excellence.
• Strong analytical mindset with a structured approach to debugging and root cause analysis.Qualifications:Minimum Qualifications
• Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or related field.
• Minimum 7+ years of relevant experience in platform hardware design, board design, electrical engineering, or related disciplines.
• Strong experience in schematic capture and complex PCB design.
• Strong knowledge of digital, analog, and mixed-signal circuit design.
• Experience developing and reviewing high-speed board-level implementations.
• Working knowledge of Signal Integrity and Power Integrity principles.Thx y
• Experience performing board bring-up, validation, and hardware debugging.
• Strong understanding of high-speed interfaces and platform architectures.
• Experience using oscilloscopes, logic analyzers, protocol analyzers, and related laboratory equipment.
• Intermediate to advanced English communication skills.
Preferred Qualifications
• Experience with PCB design tools such as Cadence Allegro, OrCAD, or Mentor Graphics.
• Experience defining routing constraints and PCB design guidelines.
• Experience reviewing and approving schematics and PCB layouts.
• Strong understanding of:
PCIe Gen4/Gen5/Gen6
DDR4/DDR5
USB4
Ethernet
High-speed SerDes interfaces
• Experience performing SI/PI simulations using tools such as:
Cadence Sigrity
Ansys HFSS
SIwave
SPICE-based simulators
• Knowledge of EMI/EMC design techniques and compliance requirements.
• Familiarity with FPGA, CPLD, ASIC, and Intel platform architectures.
• Experience with DFM, DFT, and reliability methodologies.
• Knowledge of Python, automation scripting, or design workflow automation.
• Experience mentoring engineers and leading technical design reviews.
Job Type:Experienced HireShift:Shift 1 (Malaysia)Primary Location: Malaysia, PenangAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field
- Minimum 7 years of relevant experience in platform hardware design, board design, electrical engineering, or related disciplines
- Strong experience in schematic capture and complex PCB design
- Strong knowledge of digital, analog, and mixed-signal circuit design
- Experience developing and reviewing high-speed board-level implementations
- Working knowledge of Signal Integrity and Power Integrity principles
- Experience performing board bring-up, validation, and hardware debugging
- Strong understanding of high-speed interfaces and platform architectures
- Experience using oscilloscopes, logic analyzers, protocol analyzers, and related laboratory equipment
- Intermediate to advanced English communication skills
- Experience with PCB design tools such as Cadence Allegro, OrCAD, or Mentor Graphics
- Experience defining routing constraints and PCB design guidelines
- Experience reviewing and approving schematics and PCB layouts
- Strong understanding of PCIe Gen4/Gen5/Gen6, DDR4/DDR5, USB4, Ethernet, and high-speed SerDes interfaces
- Experience performing SI/PI simulations using Cadence Sigrity, Ansys HFSS, Ansys SIwave, or SPICE-based simulators
- Knowledge of EMI/EMC design techniques and compliance requirements
- Familiarity with FPGA, CPLD, ASIC, and Intel platform architectures
- Experience with DFM, DFT, and reliability methodologies
- Knowledge of Python, automation scripting, or design workflow automation
- Experience mentoring engineers and leading technical design reviews
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
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The Company
What We Do
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.
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