Physical Silicon Design Engineer

Introduction

Edgecortix Inc. is seeking a Hardware Design Engineer with proven RTL/logic and ASIC design expertise. If you have strong desire to build state-of-the-art digital chips and systems join us and let's reshape the future of AI.

Your Role and Responsibilities:

Ideal candidates will have expertise in several of the following areas:

• Work on physical implementation of SoCs, chiplets and block hardening for Edgecortix AI acceleration products in house as well as provide guidance to external design partners.
• Implement and improve in house physical implementation flows.
• Commit library and cell studies, evaluate libraries from different vendors and determine beneficial implementation strategies.
• Constantly look for ways to optimize PPA of the product at all different levels (logic and architecture, synthesis and P&R flows, floorplan, libraries, technology selection)
• Run synthesis, P&R, CTS flows using industry standard tools from Synopsys and Cadence.
• Perform power grid generation and IR-drop analysis.
• Own power analysis activities to ensure design is within the budget, and keep track of design PPA for continuous improvement.
• Work with the design team to create constraints and power intent.
• Work in a tight loop with the architecture and RTL design team providing continuous feedback to architecture and logic implementation. Analyze limiting factors and driving improvements.
• Participate in new architecture conceptualization, doing early stage analysis experiments and projections of various decision outcomes. Participate in power and area budgeting and scoping activities.
• Perform STA to ensure design meets timing across multiple corners and scenarios.
• Analyze timing failures and work with the design team to resolve the root cause of the issue.
• Create floor plans and come up with best ways to partition architecture for hierarchical implementation.
• Create ECO patches based on design team inputs.
• Stay in touch with the industry trends and drive new tools, latest techniques and methodologies adoption internally.

Required Qualifications:

• Bachelor in Electrical Engineering, Computer Engineering, Computer Science or similar.
• 5+ years of hands-on experience with physical design of high-performance or power-efficient SoC designs. Prior experience in tape out of complex SoC`s involving multiple IP`s (PCIE,DDR, CPU`s etc.)
• Good understanding of the end-to-end RTL to GDSII flow.
• Strong understanding of physical design decisions on power efficiency and performance.
• Hands on experience across synthesis, P&R, CTS and timing closure.
• Hands-on experience of doing STA using industry standard tools such as Cadence Tempus.
• Hands-on experience with advanced technology nodes such as 16/12 nm and below.

Preferred Qualifications:

• Master in Electrical Engineering, Computer Engineering, Computer Science or similar.
• 10+ years of hands-on experience with physical design of high-performance or power-efficient SoC designs. Chiplet implementation and sign-off experience is a plus.
• Understanding and ability to optimize interrelations between physical design of the die and package design.
• Hands on experience of doing and optimizing across P&R, floor plan, clock tree synthesis and power grid generation.
• Hands on experience in IR-drop analysis , LVS , electrical verification such as electrical rule checks, shorts, ESD checks, etc.
• Hands on experience with low-power, multi voltage, multi power domain designs, power gating, isolation, ability to define and maintain UPF based on design team requirements,
• Good grasp of timing closure methodologies. Experience of closing complex multi-corner multi-scenario designs.
• Deep understanding of physical factors contributing to design performance such as noise, crosstalk, and OCV effects etc.
• Hands on experience in ECO implementation, creating and applying ECO patches based on RTL design team changes.
• Outstanding analytical and communication skills, an ability to communicate with the RTL design team to achieve globally optimal design outcomes. Experience in providing actionable feedback for logic optimization.
• Strong ability to drive issues to resolution across different counterparties such as RTL design team, package design team and tool and IP vendors.

What’s in it for you?

Make a difference: you will have the opportunity to join a well-funded fabless AI semiconductor startup that is disrupting the AI software and hardware co-design space. Be an integral part of its growth and momentum.

Benefits and Perks

· Highly competitive salary and stock options

· Flex work time and ability to work fully remotely

· Support for obtaining visa and relocation support (in case of non-remote)