Physical Failure Analysis Engineer II

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Job Description:

We are seeking an experienced Physical Failure Analysis Engineer II with 2–5 years of hands-on experience to support semiconductor failure analysis. The ideal candidate will have deep expertise operating a Dual Beam Focused Ion Beam / Scanning Electron Microscope (FIB/SEM) and strong skills in sample preparation techniques to enable accurate root-cause analysis. This role will work closely with failure analysis engineers to analyze physical defects, packaging issues, and structural failures across a variety of device technologies.

Requirements/Qualifications:

Key Responsibilities

• Operate and maintain Dual Beam FIB/SEM systems for:
  • Site-specific cross-sectioning
  • Circuit editing
  • TEM lamella preparation
  • Defect localization and characterization

• Perform package decapsulation using chemical, mechanical, laser, and plasma-based techniques.
• Execute precision CNC milling for sample exposure and preparation.
• Conduct X-ray analysis (2D/3D) for non-destructive internal inspection.
• Perform C-SAM (Scanning Acoustic Microscopy) for delamination, void, and crack detection.
• Apply additional sample preparation techniques including:
  • Mechanical polishing
  • ion milling
  • Chemical etching
  • Plasma cleaning

• Document analysis procedures, findings, and results in detailed technical reports.
• Collaborate with engineering teams to support root cause analysis and corrective action development.
• Maintain lab equipment, follow EHS protocols, and support continuous improvement of FA processes.

Required Qualifications

• 2-5 years of experience in physical failure analysis or related semiconductor/electronics lab environment.
• Expert-level proficiency with Dual Beam FIB/SEM systems 
• Strong understanding of semiconductor device structures and electronic packaging.
• Ability to interpret SEM images, cross-sections, and failure signatures.
• Experience with technical documentation and report writing.

Requirements/Qualifications:

• Bachelor’s or Master’s degree in Chemistry, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, or a related technical field.
• Experience with advanced packaging (BGA, QFN, CSP, flip-chip, wafer-level packaging).
• Familiarity with TEM sample preparation and coordination with TEM analysis.
• Hands-on experience with:
  • Package decapsulation
  • CNC milling
  • X-ray inspection
  • C-SAM analysis

Work Environment

• Laboratory-based role requiring use of advanced analytical equipment
• May involve handling chemicals and operating precision machinery
• Compliance with EHS standards is required

Travel Time:

Physical Attributes:

Physical Requirements:

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster.

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.