Physical Design Engineer

Sorry, this job was removed at 12:05 a.m. (CST) on Friday, May 01, 2026
Be an Early Applicant
San Jose, CA, USA
In-Office
141K-226K Annually
Software • Semiconductor • Manufacturing
The Role

Please Note:

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)

2. If you already have a Candidate Account, please Sign-In before you apply.

Job Description:

The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.

We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners.

This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities:

  • Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.

  • DRC, LVS, and electrical checking.

  • Ability to automate common processes and design steps.

  • Development of high-speed signal interconnects working alongside SI and PI engineers.

  • Electrical analysis and optimization of ubump and RDL patterns.

  • Evaluation and development of new 2.5D and 3D interconnect technologies.

  • Technology and testchip roadmapping with a focus on advanced packaging.

Skills and Experience:

  • Independent, self-starter who can work across a worldwide organization and customer base.

  • Ability to manage multiple concurrent customers under short timelines.

  • Comfort with providing guidance and direction with incomplete information.

  • Experience with various IC, Package and PCB layout databases and tools.

  • Strong TCL, Python scripting experience to automate routine tasks.

  • Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.

Additional Job Description:

Compensation and Benefits
The annual base salary range for this position is $141,300 - $226,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Broadcom Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.

  • Equity Value & Accessibility Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
  • Retirement Support A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
  • Pay Growth & Progression Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.

Broadcom Insights

Similar Jobs

Micron Technology Logo Micron Technology

Design Engineer

Artificial Intelligence • Hardware • Information Technology • Machine Learning
In-Office
2 Locations
45000 Employees
177K-334K Annually

Broadcom Logo Broadcom

Design Engineer

Software • Semiconductor • Manufacturing
In-Office
San Jose, CA, USA
38985 Employees
122K-195K Annually

Broadcom Logo Broadcom

Design Engineer

Software • Semiconductor • Manufacturing
In-Office
San Jose, CA, USA
38985 Employees
144K-230K Annually

System Canada Technologies Logo System Canada Technologies

Design Engineer

Information Technology • Professional Services • Software • Consulting
In-Office
Irvine, CA, USA
Get Personalized Job Insights.
Our AI-powered fit analysis compares your resume with a job listing so you know if your skills & experience align.

The Company
HQ: San Jose, CA
38,985 Employees
Year Founded: 1991

What We Do

Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.

Similar Companies Hiring

Hanover Park Thumbnail
Artificial Intelligence • Fintech • Software • Financial Services
New York, New York
42 Employees
Kepler  Thumbnail
Fintech • Software
New York, New York
6 Employees
Onshore Thumbnail
Artificial Intelligence • Fintech • Software • Financial Services
New York, New York
60 Employees

Sign up now Access later

Create Free Account

Please log in or sign up to report this job.

Create Free Account