Physical Design Engineer

Posted Yesterday
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San Jose, CA, USA
In-Office
83K-132K Annually
Junior
Software • Semiconductor • Manufacturing
The Role
Supports physical implementation of advanced ASICs, including floorplanning, placement and routing, clock-tree synthesis, static timing analysis, timing closure, physical verification, IR drop and electromigration analysis, and signoff. Develops automation scripts in TCL, Python, Ruby, or Bash. The role focuses on next-generation networking, AI/ML, and cloud ASICs using advanced semiconductor nodes and EDA tools.
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Job Description:

Physical Design Engineer (New College Grad) — ASIC Products Division (APD)

Location: San Jose, CA

Position Type: Full-Time


Who We Are — Physical Design Team in APD

Broadcom’s ASIC Products Division (APD) is the global leader in custom high-performance silicon solutions. We partner with the world’s most innovative technology companies—spanning hyper-scale cloud providers, AI pioneers, and tier-1 networking infrastructure leaders—to co-design and manufacture complex, custom ASICs that power the modern digital backbone.


The Physical Design team within APD is the world-class execution engine behind the industry's most advanced custom silicon. We push the limits of silicon technology by combining deep architectural expertise, advanced IP, cutting-edge physical design methodologies in 3nm/2nm/A14 nodes, and advanced 2.5D/3D chiplet integration to solve the most demanding compute and bandwidth challenges.We transform ultra-complex architectures into fully realized, high-yielding, first-pass silicon success.


What Defines Our Physical Design Team
  • Pioneering First-Pass Silicon in 3nm/2nm: Our team consistently pushes the boundary of physics, taking the largest and most complex die sizes from floorplan to tapeout on leading-edge foundry nodes (N7, N5, N3, and N2).
  • Record-Breaking Scale & Complexity: We regularly execute full-chip physical implementation for ultra-large-scale ASICs exceeding tens of billions of transistors, multi-gigahertz clock frequencies, and dense multi-die 2.5D/3D integration (CoWoS, HBM3/4, chiplet architectures).
  • Methodology & Flow Leadership: We develop and maintain cutting-edge in-house (AI Driven) automation and methodology across different EDA tools, setting the benchmark for signoff quality and turn-around-time (TAT).

About the Role

Broadcom’s ASIC Products Division (APD) is looking for a motivated Physical Design Engineer (NCG) to join our Physical Design team. In this role, you will work alongside experienced engineers in executing the  implementation tasks for next-generation high-performance networking, AI/ML accelerators, and custom cloud ASICs. In this role, you will gain hands-on experience in complex block-level floorplanning, synthesis, Place and Route (P&R), clock tree synthesis (CTS), timing closure, and signoff across cutting-edge deep sub-micron nodes (N5/N3/N2/A14).


Key Responsibilities
  • Participate in block-level floorplanning, and run placement and route (P&R) flows using industry-standard EDA tools.
  • Perform Static Timing Analysis (STA), debug timing paths, and execute ECOs for timing closure.
  • Run Physical Verification checks (DRC, LVS, ERC, Antenna) and resolve signoff violations.
  • Analyze IR drop and electromigration (EM) to ensure power grid integrity.
  • Develop and maintain automated scripts (TCL, Python, Ruby) to enhance flow efficiency and productivity
Basic Qualifications
  • Education: Bachelor's Degree in Electrical Engineering, Computer Engineering + 2yrs of experience or Master’s degree in Electrical Engineering, Computer Engineering (Graduation date within the past 12 months).
  • Solid understanding of digital CMOS logic design, standard cell libraries, and semiconductor fundamentals.
  • Familiarity with static timing analysis (STA) concepts, clocking, and setup/hold timing.
  • Hands-on coursework, lab experience, or academic projects using EDA design tools (Cadence Innovus/Tempus, Synopsys IC Compiler II/PrimeTime, or Siemens tools).
  • Proficient in scripting languages such as TCL, Python, Ruby, or Bash.

Preferred Qualifications
  • Prior internship or research experience in ASIC physical design, synthesis, or physical verification.
  • Basic understanding of Design for Testability (DFT), low-power intent (UPF/CPF), and FinFET technologies.
  • Excellent problem-solving, debugging, and analytical skills.

Work Authorization / Eligibility Requirements
  • Legal authorization to work in the U.S. is required

Compensation and Benefits


The annual base salary range for this position is USD 82,500.00 To USD 132,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Skills Required

  • Bachelor's degree in Electrical Engineering or Computer Engineering plus 2 years of experience, or a Master's degree in Electrical Engineering or Computer Engineering with graduation within the past 12 months
  • Solid understanding of digital CMOS logic design, standard cell libraries, and semiconductor fundamentals
  • Familiarity with static timing analysis concepts, clocking, and setup/hold timing
  • Hands-on coursework, lab experience, or academic projects using EDA design tools such as Cadence Innovus/Tempus, Synopsys IC Compiler II/PrimeTime, or Siemens tools
  • Proficiency in TCL, Python, Ruby, or Bash scripting
  • Legal authorization to work in the United States
  • Prior internship or research experience in ASIC physical design, synthesis, or physical verification
  • Basic understanding of Design for Testability, low-power intent using UPF/CPF, and FinFET technologies
  • Excellent problem-solving, debugging, and analytical skills

Broadcom Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.

  • Equity Value & Accessibility — Equity awards such as RSUs and an ESPP can substantially increase total compensation, particularly in technical and senior roles. Stock-based pay is often a major component of earnings and can make offers especially attractive when shares perform well.
  • Retirement Support — A 401(k) match reportedly up to 6% with immediate vesting strengthens long-term savings. This feature provides clear value for employees prioritizing retirement contributions.
  • Healthcare Strength — Offerings include medical, dental, vision, mental-health coverage and HSA/FSA options, alongside fertility, adoption, childcare benefits, and caregiver leave. This breadth signals a comprehensive set of health and family supports.

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The Company
HQ: Palo Alto, CA
38,985 Employees
Year Founded: 1991

What We Do

Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.

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