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Job Description:The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.
We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners.
This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.
Responsibilities:
Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.
DRC, LVS, and electrical checking.
Ability to automate common processes and design steps.
Development of high-speed signal interconnects working alongside SI and PI engineers.
Electrical analysis and optimization of ubump and RDL patterns.
Evaluation and development of new 2.5D and 3D interconnect technologies.
Technology and testchip roadmapping with a focus on advanced packaging.
Skills and Experience:
Independent, self-starter who can work across a worldwide organization and customer base.
Ability to manage multiple concurrent customers under short timelines.
Comfort with providing guidance and direction with incomplete information.
Experience with various IC, Package and PCB layout databases and tools.
Strong TCL, Python scripting experience to automate routine tasks.
Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.
Compensation and Benefits
The annual base salary range for this position is USD 143,800.00 To USD 230,000.00
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- Bachelor's degree in Electrical Engineering or Computer Science with 12+ years related experience; or Master's degree with 10+ years related experience.
- Strong TCL scripting experience to automate routine tasks.
- Strong Python scripting experience to automate routine tasks.
- Experience with IC, package, and PCB layout databases and tools.
- Physical layout implementation experience for power grids, 2.5D and 3D die-die interconnects.
- Experience performing DRC, LVS, and electrical checking.
- Experience developing high-speed signal interconnects and working with SI and PI engineers.
- Experience with electrical analysis and optimization of ubump and RDL patterns.
- Ability to work independently, manage multiple concurrent customers, and meet short timelines.
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.
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