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Job Description:Description
As a Photolithography Engineer with the Wireless Semiconductor Division (WSD), you will develop and sustain new and enabling unit processes in our existing high volume Si MEMS production facilities located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Equipment Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. We are looking to hire a talented, highly motivated engineer responsible for challenging and rewarding work.
Responsibilities:
Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.
Combination of layer and process tool ownership. Responsible for managing CD and overlay SPC charts, along with layer defect monitoring.
Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS Silicon based technologies. This will include sustaining high volume manufacturing lines, as well as some new processes, materials, and applications development.
Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.
Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership, working across roles & teams, both internal and external, to deliver benefit to the business.
Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.
Organizes and manages long-term improvement projects to meet organizational goals. Work with peers and the equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects.
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).
Qualifications:
BS (MS or higher preferred) in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years of related experience. Or MS in EE, ME, ChE, Material Sciences, Physics or Chemistry and 6+ years related experience. Or PhD in EE, ME, ChE, Material Sciences, Physics or Chemistry and 3+ years of related experience
Expertise in photolithography, this position designed for highly autonomous experts. This is not an entry level position.
Proficiency in a wide variety of photolithography tools. Experience with TEL_ACT8 and PAS5500 equipment is highly desirable. Experience with Wafer-Level Packaging (WLP), through silicon vias (TSVs), or thick resist processing (e.g. polyimides, chem amp resists, etc.) is desirable
Exposure Focus: Deep experience with ASML equipment (PAS5500), advanced process control, overlay optimization, and i-line steppers.
Track Focus: Deep track background (TEL_ACT8) focused on R&D, new layer development, and new resist materials selection.
Expertise in engineering fundamentals for all areas of fab processing
Understanding of general processing techniques and concepts for silicon-based MEMS devices applications including interdependencies with other unit processes.
Strength in Statistical Process Control for a high-volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required.
Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
Proven ability to work in a dynamic environment and deliver results.
Strong troubleshooting skills.
Excellent ownership, initiative and communication skills.
Track record of self-motivated and collaborative learning.
Ability to prioritize and multitask.
Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment.
Attention to detail is essential.
Legal authorization to work in the U.S. is required.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $109,700 - $175,500
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Skills Required
- BS in EE, ME, ChE, Materials Science, Physics or Chemistry with 8+ years experience OR MS with 6+ years OR PhD with 3+ years
- Expertise in photolithography and autonomous process engineering
- Proficiency with a wide variety of photolithography tools and ownership of layer/process tool sets
- Experience with TEL_ACT8 track systems
- Experience with ASML PAS5500 / i-line steppers and related exposure systems
- Experience with Wafer-Level Packaging (WLP), through-silicon vias (TSVs), or thick resist processing (e.g., polyimides, chemically amplified resists)
- Strong engineering fundamentals across fab processing and understanding of silicon-based MEMS process interdependencies
- Strength in Statistical Process Control for high-volume manufacturing
- Mature data analysis skills using JMP, Minitab, Spotfire, Excel/Access
- Practical experience with Fault Detection & Classification (FDC), Copy Exactly (CE!), High Precision Maintenance (HPM), TPS, or Lean
- Proven ability to work in a dynamic environment and deliver results
- Strong troubleshooting skills
- Excellent ownership, initiative, communication, and cross-functional teamwork skills
- Ability to prioritize, multitask, and manage long-term improvement projects
- Attention to detail
- Legal authorization to work in the U.S.
Broadcom Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.
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Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
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Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
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Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.
Broadcom Insights
What We Do
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions.








