Package Development Engineering Core Engineering Module (PDE CEM) Engineer

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Penang, Daerah Timor Laut, Penang
In-Office
Artificial Intelligence • Hardware • Information Technology • Machine Learning • Semiconductor
The Role

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR48927 Package Development Engineering Core Engineering Module (PDE CEM) Engineer (Evergreen)

As a PDE CEM Engineer you will be primarily responsible for developing and optimizing processes to meet the schedule of business cases. To work on new product introduction and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You need to perform DOE and handle the NPI runs for the recipe creation and verification to verify the process performance and collect the data to reports. You will also be required to identify, diagnose, and resolve assembly process related problems by applying problem solving skills. 

Job Responsibilities: 

  • Execute smooth transfer of new products and packages from NPI to HVM site 

  • Work with cross functional team and sites to execute smooth products transfer 

  • Validate and document baseline the POR, TOR and BOM for the transferred products and packages 

  • Execution of the qualification of NPI packages build that proliferate from the pilot products and packages according to planned timeline 

  • Execution of NPI Customer samples and Engineering Samples build for new products and packages according to planned timeline 

  • Evaluate and Improve Assigned Assembly Processes, Materials, and/or Equipment 

  • Participate in process, tool and material optimization to drive best in class packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reduction 

  • Maintain in-depth assembly process and packaging knowledge, included materials and equipment knowledge as packaging integration.  

  • Identify all process variables, and Optimize process and/or equipment variables 

  • Perform containment of process and equipment deviations, and lead root cause finding and implement corrective actions 

  • Develop Process of Record (POR), define process edges and center the process (CPK), Apply DOE (Design of Experiments) techniques for process characterization 

  • Develop Process Capability Roadmap and Evaluate Equipment and/or Material Technologies 

Job Requirements: 

  • Masters or bachelor’s degree in an Engineering 

  • Experience in backend engineering process or assembly package technology development preferred 

  • At least 3 years experience in semiconductor industry and candidates with proven experience in wire bond, die attach, encapsulation, post-encapsulation, wafer are highly encouraged to apply.

  • Excellent problem-solving skill, and good in data analysis, statistical analysis, data interpretation skills 

  • A good team player equips with excellent interpersonal and communication skills. 

  • Highly result driven individual, self-motivated and ability to multi-task and manage dynamic priorities 

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.


To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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The Company
HQ: Boise, ID
40,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

From smartphones and tablets to PCs and the data centers delivering services to these devices, Micron memory can be found fueling the applications you rely on every day. Micron memory is engineered to meet exacting needs in the most demanding environments across a wide range of applications including AI, automotive, mobile, data center and client. Because data is everywhere, Micron memory is everywhere, too.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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