Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages. Responsible for package architecture, substrate design, flip-chip integration, passive component assembly, reliability qualification, and manufacturing readiness. Collaborate closely with Product Engineering, Silicon Design, Reliability, Operations, OSATs, and suppliers to deliver high-performance, cost-effective power packaging solutions.
Responsibilities- Lead package development from concept through production release.
- Define package architecture, materials selection, and assembly process flow.
- Develop and optimize substrate designs including stack-up, routing, power planes, via structures, and thermal features.
- Drive flip-chip integration, bump design, underfill selection, and assembly process optimization.
- Develop passive component integration strategies for capacitors, resistors, and magnetic components.
- Perform electrical, thermal, and mechanical performance optimization.
- Lead package qualification and reliability testing per JEDEC and IPC standards.
- Conduct root cause analysis and implement corrective actions for package failures.
- Collaborate with OSATs and suppliers on DFM, process development, yield improvement, and cost reduction.
- Support NPI execution and transfer technologies into high-volume manufacturing.
- BS/MS in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
- 10+ years of semiconductor package development experience.
- Strong expertise in:
- Multi-Phase Power Modules, DrMOS, and SPS packaging
- Advanced substrate design and manufacturing
- Flip-chip assembly and package integration
- Passive component assembly and optimization
- Thermal management and reliability engineering
- High-volume manufacturing and NPI processes
- Experience working with OSATs, substrate suppliers, and material vendors.
- Strong communication skills, with the ability to effectively collaborate with Business Units, cross-functional teams, internal and external manufacturing partners, and customers.
- Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
- Proven ability to lead projects across organizations and cultures in a fast-paced environment.
onsemi is excited to share the base salary range for this position is $150,000.00 to $249,780.00. The Range exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members. We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf
About UsMore details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
Skills Required
- BS or MS degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
- 10+ years of semiconductor package development experience
- Expertise in multi-phase power modules, DrMOS, and SPS packaging
- Expertise in advanced substrate design and manufacturing
- Experience with flip-chip assembly and package integration
- Experience with passive component assembly and optimization
- Experience with thermal management and reliability engineering
- Experience with high-volume manufacturing and NPI processes
- Experience working with OSATs, substrate suppliers, and material vendors
- Strong communication and cross-functional collaboration skills
- Proficiency with ACAD, 8D, SPC, DFMEA, and DOE
- Ability to lead projects across organizations and cultures in a fast-paced environment
onsemi Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about onsemi and has not been reviewed or approved by onsemi.
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Retirement Support — Retirement programs are highlighted by a U.S. 401(k) with a 100% match on the first 4% and immediate vesting. International plans such as Ireland’s defined contribution scheme and Germany’s company-funded pension elements reinforce long-term savings.
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Leave & Time Off Breadth — Time-off policies include ten paid holidays, flexible vacation for exempt employees, and three to five weeks of vacation for non-exempt staff as tenure grows, alongside sick time accrual. Paid leaves span parental, bereavement, jury duty, and military service, with Europe locations offering additional statutory and seniority-based days.
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Parental & Family Support — Family supports include eight weeks of paid parental leave, company-sponsored backup care for children, adults, and pets, and up to $15,000 in adoption assistance. Regional provisions such as Switzerland’s child allowance and accessible EAP counseling show added attention to household needs.
onsemi Insights
What We Do
We are building a better future through intelligent technology. For over 60 years, onsemi and its ancestors have been leading the world’s greatest technology advancements. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
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