Broadcom

Package Design Engineer

Posted Yesterday

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Hiring Remotely in Yishun, SGP

Remote

Senior level

Software • Semiconductor • Manufacturing

The Role

Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G. Responsibilities include package layout and routing, high-speed SerDes and RF structures, impedance matching, signal and power integrity, thermal management, manufacturability, reliability, and coordinating multiple projects with global teams and external vendors.

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Job Description:

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
Schedule, prioritize, & track your work across multiple projects simultaneously
General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered.
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
Experience with 2.5D and 3DIC packages is highly advantageous.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Skills Required

Bachelor’s degree in Electrical Engineering, Electronics Engineering, or a similar field, with 5+ years of flip-chip BGA package design experience including high-speed SerDes
Master’s degree in Electrical Engineering, Electronics Engineering, or a similar field, with 3+ years of flip-chip BGA package design experience including high-speed SerDes
Knowledge of package-level signal integrity and power integrity
Ability to collaborate with worldwide teams across multiple time zones and external vendor designers
Organizational and task-management skills for managing multiple package design projects
Cadence APD experience or equivalent package design tools
Bachelor’s degree with 8+ years of flip-chip BGA package design experience including high-speed SerDes
Master’s degree with 6+ years of flip-chip BGA package design experience including high-speed SerDes
Experience with 2.5D and 3DIC packages

Broadcom Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Broadcom and has not been reviewed or approved by Broadcom.

Equity Value & Accessibility — Equity is used broadly through RSUs with quarterly or annual vesting, and an ESPP with a discount and look‑back that can add meaningful upside. Company disclosures show ongoing equity grants, including inducement RSUs tied to acquisitions, underscoring equity’s central role in total rewards.
Retirement Support — A 401(k) plan with a competitive company match and immediate vesting is consistently highlighted, supporting long‑term savings. Tax‑advantaged accounts like HSA/FSA further strengthen the financial wellness toolkit.
Pay Growth & Progression — Compensation ceilings in technical tracks are described as high, with wide ranges and very strong totals for experienced engineers. Sales compensation is also characterized as competitive, supporting attractive on‑target earnings.