Optoelectronic IC Package Design Director

Reposted 8 Days Ago
Be an Early Applicant
New Providence, NJ, USA
In-Office
236K-376K Annually
Expert/Leader
Cloud • Hardware • Internet of Things • Other • Software • Utilities
Ciena is a networking systems, services, and software company.
The Role
The Optoelectronic IC Package Design Director leads the package development for custom photonic, analog, and digital ICs, manages schedules and designs, and coordinates with cross-functional teams.
Summary Generated by Built In

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.

As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules.

How You Will Make an Impact:

  • Own and drive advanced package selection, new product BGA configuration, and package structure
  • Own and manage package development schedules
  • Responsible for package layout, SI/PI optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
  • Simulate and optimize signal and power integrity and RF performance of the package design
  • Interface and work with CMs and vendors for sourcing existing designs and future product development

The Must Haves:

  • BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus)
  • 10+ years hands on experience with IC package design experience

The Nice to Haves:

  • Substrate design experience for RF, digital, high speed and mixed signal designs
  • Thorough understanding of signal and power integrity fundamentals
  • Experience with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
  • Fluent in SI/PI and EM simulation tools such as SIWave and HFSS
  • Experience in package design electrical review, SI/PI analysis
  • Experience in package design for manufacturing reviews
  • Experience in thermal and mechanical design is a plus
  • Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
  • Problem solver with strong engineering fundamentals

Pay Range: The annual salary range for this position is $235,600 - $376,400.

Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.

Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.
At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard.  Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.

Ciena is an Equal Opportunity Employer, including disability and protected veteran status.

If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.

Top Skills

Bga Configuration
Cadence
Electromagnetic Simulation
Hfss
Ic Package Design
Si/Pi Optimization
Signal Integrity Simulation
Siwave
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The Company
HQ: Hanover, MD
9,561 Employees
Year Founded: 1992

What We Do

Ciena (NYSE: CIEN) is a global leader in networking systems, services, and software. We build the world’s most adaptive networks to enable our customers to deliver richer, more connected experiences for all users. At our core, Ciena is a company rooted in people. We prioritize deep, collaborative relationships within our teams and alongside our customers, partners, and communities around the world. For three-plus decades, we’ve brought our humanity to our relentless pursuit of innovation. We continue to lead the evolution of networking with a strong track record of industry firsts. As end-user expectations skyrocket, our customers and their networks must transform. Ciena powers this transformation by driving next-generation solutions built for maximum openness and agility—today and into the future. Corporate/Brand Values: • Customer First • Integrity • Velocity • Innovation • Outstanding People We're the perfect size for you to make an impact. W Only Ciena has the depth of expertise and the culture of collaboration and partnership required to help our partners evolve. We do this by strategically integrating hardware, services, and software in an open environment to ensure our clients’ networks are ‘fit for flexibility’ today and into the f

Why Work With Us

We are known for our industry-firsts, including the first coherent optical solution, converged packet-optical platform, and intelligence automation platform. Our commitment extends beyond innovation, logging in over 35,000 volunteer hours and $2 million to worthy causes in 2023. We're the perfect size and culture for you to make a difference.

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