Optical Interconnect Process Engineer

Posted Yesterday
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London, Greater London, England, GBR
In-Office
121K-121K Annually
Senior level
Artificial Intelligence • Semiconductor • Manufacturing
The Role
The Optical Interconnect Process Engineer is responsible for designing, optimizing, and manufacturing optical interconnect systems, ensuring high performance and reliability through process development and yield analysis.
Summary Generated by Built In
About OLIX

AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance.

Role

As an Optical Interconnect Process Engineer at OLIX, you will be responsible for translating optical interconnect architectures into scalable, manufacturable, and reliable hardware.This role focuses on optical packaging, fiber and waveguide integration, polymer waveguide manufacturing, optical alignment, yield, and production readiness for high-density optical systems, bonded-optics-to-ASIC (BOA), and co-packaged optics (CPO). You will work hands-on across prototyping, validation, manufacturing, characterization, and yield, ensuring designs can be built at scale with high performance and reliability.

Responsibilities

Optical Interconnect Implementation

  • Design and optimize high-density fiber-optic and waveguide interconnects Develop fiber-to-waveguide and fiber-to-package coupling solutions Work with PLC-based routing, multiplexing, and signal distribution systems Define alignment strategies and tolerances for high-volume assembly.

Packaging & Integration

  • Drive co-packaged optics (CPO) integration at package and system level Address opto-mechanical constraints including connectors, fixturing, and alignment Partner with mechanical and thermal teams on integrated system design Evaluate thermal interactions between ASICs and photonic components.

Process Development & Manufacturing

  • Develop processes for optical assembly, alignment, and test Apply Design for Manufacturing (DFM) principles to optical systems Work with foundries, OSATs, and contract manufacturers Support pilot builds and production ramp.

Yield, Reliability & Validation

  • Analyze tolerance sensitivities and yield drivers Investigate variability and resolve production issues Define and execute validation plans for optical assemblies Ensure reliability, serviceability, and field-replaceability.

Skills & Experience
  • 5–15 years of experience in advanced micro-fabrication, with deep process integration expertise.

  • Experienced collaborating with external fabs, R&D consortia, or tool vendors to develop or transfer new capabilities.

  • Proven record creating or modifying complete process flows for novel optoelectronic devices.

  • Background in some of: photolithography, DRIE/RIE, thin-film deposition (PVD/ALD), wafer bonding, or wet etch.

  • Comfortable switching between hands-on work and high-level process architecture and partner coordination.

  • Proficient in DOE/SPC tools (JMP, Python, etc.) and disciplined process documentation.

  • B.Eng./M.Sc./Ph.D. in Materials Science, Electrical/Mechanical Engineering, Physics, or related field.

  • Excellent communicator; thrives in fast-moving, interdisciplinary environments.

Bonus
  • Familiarity with wafer-level packaging or flip-chip integration.

  • Experience transferring R&D processes to external pilot or production environments.

  • Working knowledge of simulation and characterisation (FEM, profilometry, interferometry, L-I-V, or spectral testing).

Compensation & Equity
  • Competitive Salary: £121,000+, commensurate with your experience, skills, and location.

  • Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it.

  • Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer a £24k annual Living-Local Bonus if your residence is within 20 minutes of the office.

Health & Wellbeing
  • Premium Healthcare: Comprehensive BUPA medical and dental cover, including Medical History Disregarded (MHD), for complete peace of mind.

  • Time Off: 25 days of annual leave, plus all UK bank holidays.

The Workspace & Tech
  • Elite Hardware: M4 Macs come as standard, with M5 Pro upgrades for our engineering team. We will provide whatever you need to do your best work.

  • Optimal Environment: High-spec noise-cancelling headphones and a fully ergonomic workstation designed for deep focus.

  • Rapid Prototyping: Access to our high-performance 3D printing lab for work, experimentation, and personal creative projects.

Life at the Office
  • Chef-prepared meals: if you need to work late.

  • Caffeine on Us: We’ve got you covered with a tab at our favourite local coffee shop.

Relocation & Global Mobility
  • Visa Sponsorship: We hire the best in the world. We offer full UK and international visa sponsorship.

  • Seamless Relocation: Whether you’re moving across the country or across the globe, our dedicated relocation partner provides funding and concierge support to get you settled.

Due to U.S. export control regulations, candidates’ eligibility to work at OLIX depends on their most recent citizenship or permanent residency status. We are generally unable to consider applicants whose most recent citizenship or permanent residence is in certain restricted countries (currently including Iran, North Korea, Syria, Cuba, Russia, Belarus, China, Hong Kong, Macau, and Venezuela). Applicants who have subsequently obtained citizenship or permanent residency in another country not subject to these restrictions may still be eligible.

Skills Required

  • 5-15 years of experience in advanced micro-fabrication
  • Experience in photolithography, DRIE/RIE, thin-film deposition, wafer bonding, or wet etch
  • B.Eng./M.Sc./Ph.D. in Materials Science or Electrical/Mechanical Engineering
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The Company
82 Employees
Year Founded: 2024

What We Do

The latest generation of AI models achieve breakthrough performance by using vastly more tokens to solve complex problems. As frontier models become more sophisticated, demand is compounding faster than today’s infrastructure can scale. Even the most dominant players, with full-stack control across silicon, software, and supply chains, are unable to solve this within the existing architecture. Inherent constraints in physical design and packaging mean a GPU-based approach is incapable of simultaneously delivering high throughput and high interactivity at low cost. Continuing AI’s advance and making it available to everyone requires a new compute paradigm. One that can overcome the fundamental limits of memory, energy, and speed that define today’s systems. If you like working on difficult and consequential problems, we want you at OLIX. We have offices in London, Austin, Toronto, San Francisco and Bristol. Check out our careers page at olix.com/careers

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