NXP Semiconductors

NPI Process Development Engineer

Posted 27 Days Ago

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Kuala Lumpur, Wilayah Persekutuan Kuala Lumpur, MYS

In-Office

Mid level

Automotive • Internet of Things • Mobile • Semiconductor • Industrial

The Role

Develops and qualifies semiconductor assembly processes and packages for automotive applications. Owns quality, yield, cost, process improvement, documentation, specifications, work instructions, and control procedures. Collaborates cross-functionally and with management to resolve issues, mitigate risks, and deliver key projects. Applies process characterization, statistical process control, and problem-solving expertise across dicing, bonding, molding, ball attach, marking, and singulation operations.

Summary Generated by Built In

•Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications.

•Responsible for quality, yield, cost and process improvement activities.

•Responsible for process documentation, process spec, standard work instruction, OCAP, QIT etc.

•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.

•Take ownership to work closely with upper management to align scope and direction of key projects.

Requirements:

•3-6 years of work experience with semiconductor assembly background for automotive customers.

•Experience in LQFP, MAPBGA, SiP, FCCSP, FCBGA etc. packing development will be an added advantage.

•Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, singulation etc.

•Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.

•Good SPC, Process Control and other relevant statistical & problem-solving skills

•Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

More information about NXP in Malaysia...

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Skills Required

3-6 years of work experience in semiconductor assembly for automotive customers
Experience with LQFP, MAPBGA, SiP, FCCSP, or FCBGA package development
Technical knowledge and hands-on experience in process characterization for laser dicing, plasma dicing, mechanical sawing, die bonding, wire bonding, molding, ball attach, marking, and singulation
Strong interpersonal and leadership skills
Results-oriented, self-driven, and eager to succeed
Knowledge of SPC, process control, statistical methods, and problem-solving
Proficiency with Microsoft PowerPoint, Excel Macros, and Word
Project management knowledge

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The Company

HQ: Eindhoven

21,993 Employees

Year Founded: 2006

What We Do

NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 employees in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com. Privacy Policy: https://www.nxp.com/company/about-nxp/privacy-policy-for-social-media-pages:PRIVACY-POLICY-SOCIAL-MEDIA