The Thin Films Senior Process Engineer will support PVD, CVD, and ALD technologies for dielectric and metal thin-film deposition in a high-volume manufacturing environment.
Key Responsibilities
- Apply advanced expertise in thin-film deposition processes to drive continuous improvement in process performance, sustainment, and technology development.
- Collaborate with upstream and downstream partners to deliver manufacturing improvements through strong cross-functional engagement and stakeholder management.
- Own manufacturing processes and/or equipment, ensuring achievement of key performance indicators (KPIs) including safety, quality, cost, productivity, defect reduction, and yield improvement.
- Develop and execute strategic plans for complex projects, coordinating timelines and dependencies across multiple teams and initiatives.
- Support manufacturing capacity expansion and technology transfer activities to enable successful ramp-to-volume production.
- Partner with equipment vendors and cross-functional stakeholders to troubleshoot technical challenges, improve tool performance, and enhance operational efficiency.
- Lead process development initiatives that support current and next-generation high-volume manufacturing technologies.
- Design and optimize excursion prevention and detection systems to strengthen process control and minimize manufacturing risk.
- Lead equipment installation, conversion, qualification, and readiness activities during factory ramps, ensuring all tools are deployed safely, on schedule, and in compliance with quality and manufacturing standards.
- Drive root cause analysis and implement corrective actions to resolve process and equipment-related issues while improving overall manufacturing stability and performance.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
- Bachelor's degree in Chemical Engineering, Materials Science & Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related field, plus 4+ years of semiconductor manufacturing process engineering experience; or
- Master's degree in Chemical Engineering, Materials Science & Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related field, plus 2+ years of semiconductor manufacturing process engineering experience; or
Preferred Qualifications
- Strong knowledge of semiconductor manufacturing processes, process flows, equipment troubleshooting, and Model-Based Problem Solving (MBPS) methodologies.
- Experience partnering with vendor field service engineers and manufacturing/engineering technicians to improve equipment performance and reliability.
- Demonstrated technical expertise with a proven track record of driving quality improvements and process optimization initiatives.
- Experience serving as a Tool Owner and/or Process Owner in technology development, transfer, or high-volume manufacturing environments.
- Hands-on experience supporting Thin Films processes and deposition equipment.
- Strong analytical and problem-solving skills, with the ability to leverage data to identify trends and implement sustainable process improvements.
- Previous experience leading projects, mentoring engineers, or providing technical leadership within a team environment.
- Proven ability to thrive in a fast-paced, cross-functional manufacturing organization.
Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, New Mexico, AlbuquerqueAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $120,860.00-170,630.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Skills Required
- Bachelor's degree in Chemical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related field, plus 4 or more years of semiconductor manufacturing process engineering experience
- Master's degree in Chemical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Mechanical Engineering, or a related field, plus 2 or more years of semiconductor manufacturing process engineering experience
- Strong knowledge of semiconductor manufacturing processes, process flows, equipment troubleshooting, and Model-Based Problem Solving methodologies
- Experience partnering with vendor field service engineers and manufacturing or engineering technicians to improve equipment performance and reliability
- Demonstrated technical expertise and a track record of driving quality improvements and process optimization initiatives
- Experience serving as a Tool Owner or Process Owner in technology development, transfer, or high-volume manufacturing environments
- Hands-on experience supporting thin-film processes and deposition equipment
- Strong analytical and problem-solving skills using data to identify trends and implement sustainable process improvements
- Experience leading projects, mentoring engineers, or providing technical leadership within a team environment
- Ability to work effectively in a fast-paced, cross-functional manufacturing organization
Intel Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Intel and has not been reviewed or approved by Intel.
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Leave & Time Off Breadth — Sabbaticals and paid time off are highlighted as signature elements, with an established program offering four weeks after four years or eight weeks after seven years. This distinctive time off is positioned as a meaningful part of the overall package.
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Parental & Family Support — Paid bonding leave of 12 weeks and a New Parent Reintegration program, plus fertility benefits around $40,000 and up to $15,000 adoption reimbursement with no lifetime cap, are clearly stated. These programs are presented as standout components alongside broader family support resources.
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Healthcare Strength — Multiple medical plan options with 2026 updates, a shift to Spring Health for EAP, and in‑network virtual medical visits covered at 100% beginning in 2026 indicate a comprehensive offering. These features signal an emphasis on robust medical access and mental health support.
Intel Insights
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