HYBRID
Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this position now or in the future.
Seeking an experienced Product Engineer (PE) to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. This role is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing to deliver performance, quality, cost, and schedule targets at scale.
Renesas Electronics, a leading global semiconductor company, is rapidly scaling its AI-focused power delivery business. Products include high-performance digital power VRMs, multiphase controllers, Smart Power Stages (SPS), Vertical Power Stages (SPS with integrated capacitors and multiple silicon die), Power Towers (power modules integrating multiple SPS-equivalents with capacitors and inductors), and power MOSFETs.
Key Responsibilities
Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining
Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites
Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies)
Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production
Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects
Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams
Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability
Lead yield analysis, parametric trend monitoring, and root-cause investigations
Drive cost, yield, and cycle-time improvement through data-driven analysis
Own manufacturing release, qualification execution, and product change management (PCNs)
Serve as the technical escalation owner for production issues, customer returns, and corrective actions
Support critical customer engagements on product, quality, and manufacturing topics as needed
Education:
Bachelor’s degree required in Electrical Engineering, Computer Engineering, or a related field; master’s degree in a relevant engineering discipline preferred. Mechanical Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.
Experience & Skills:
Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this position now or in the future.
8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production
Strong technical depth in semiconductor power products and advanced power module manufacturing
Strong data analysis skills with the ability to interpret statistical results and drive decisions
Working knowledge of new product development, qualification, and high-volume manufacturing transfer
Strong written and verbal communication skills with customers and cross-functional teams
Proven ability to lead complex technical decisions, escalations, and execution across organizations
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
Skills Required
- Bachelor's degree in Electrical Engineering, Computer Engineering, or related field
- Master's degree in a relevant engineering discipline
- Mechanical Engineering degree (preferred for packaging and thermomechanical optimization)
- Authorized to work in the United States full-time; employer will not sponsor work visas
- 8+ years experience in semiconductor product engineering, manufacturing engineering, or test engineering with ownership from NPI through high-volume production
- Strong technical depth in semiconductor power products and advanced power module manufacturing
- Experience driving assembly processes across OSAT and internal manufacturing sites
- Familiarity with IPC-A-610 workmanship standards
- Strong data analysis skills and ability to interpret statistical results
- Working knowledge of new product development, qualification, and high-volume manufacturing transfer
- Proven ability to lead complex technical decisions, escalations, and cross-functional execution
- Strong written and verbal communication skills with customers and cross-functional teams
Renesas Electronics Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Renesas Electronics and has not been reviewed or approved by Renesas Electronics.
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Fair & Transparent Compensation — Feedback suggests pay is generally fair-to-good across many roles, with base pay aligned to prevailing market levels in multiple U.S. locations. Engineering and leadership tracks can be competitive on total compensation, reinforcing a sense that pay can meet market expectations in key job families.
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Healthcare Strength — Feedback suggests core medical, dental, and vision coverage is solid and well-regarded by employees. Day-one eligibility in U.S. roles is described, supporting confidence in access and continuity of care.
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Leave & Time Off Breadth — Feedback suggests PTO, paid holidays, sick time, and parental leave provide a comprehensive time-off framework. Company initiatives like Renesas Day and meeting-light Focus Fridays further support time away and balance.
Renesas Electronics Insights
What We Do
We're the world's leading semiconductor manufacturer. Our mission is to make our lives easier and a world that's safer, healthier, greener, and smarter.



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