MTS Package engineer - ASIC package design, logic integration and design rules

Reposted 6 Hours Ago
Be an Early Applicant
2 Locations
In-Office
143K-398K Annually
Senior level
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Your talent powers our future.
The Role
Drive next-generation memory package pathfinding and system architecture for datacenter and edge-AI products. Define packaging strategies, optimize silicon-to-system performance, and lead cross-stack co-optimization across package, board, and system design. Collaborate with silicon teams, customers, business units, and senior leaders; influence industry standards; and develop AI-based multiphysics solutions. The role requires expertise in memory systems, package design, signaling, I/O, power delivery, thermal, mechanical, reliability, and electrical performance.
Summary Generated by Built In
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We are the team defining the future of packaging of complex memory systems! Our Package pathfinding and Architecture organization sits at the intersection of silicon, packaging, systems, and customer needs-turning complex scaling challenges into technologies that power next generation platforms, through cutting edge packaging technologies. If you enjoy working on problems with real industry impact, look no further!
Key Responsibilities
  • Partner with System Architects and engineering teams to define package architecture, connectivity, and electrical requirements .
  • Develop block diagrams, schematics, and logical connectivity for system-in-package designs.
  • Create and verify package netlists using schematic and automation-based design flows.
  • Support ASIC/package co-design , including pad/bump maps, connectivity, and package integration.
  • Evaluate package designs for electrical performance, manufacturability, reliability, and system requirements .
  • Collaborate with Package Design and SI/PI teams to support physical and electrical implementation .
  • Support integration of memory, ASICs/controllers, and other devices within complex package architectures.
  • Support new and evolving interfaces such as LPDDR/DDR, ONFI, UFS, PCIe, and other high-speed protocols .
  • Lead technical reviews and resolve package connectivity and integration issues through design, validation, and product bring-up.
  • Develop technical documentation and provide technical guidance and mentoring to engineering teams.
  • Work with TPM and factory teams to develop design rules roadmap for packaging across all memory and ASIC roadmaps
  • Support improvements in package integration, design methodology, verification, and automation .
  • Support new protocol enablement (SCA-Separate Command Address, ONFI, UFS, PCIe) and capability bring-up.
  • Support debugging of root cause and failures in reliability tests by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and strive for resolution and improvements through multi-functional team partnership.
  • Helps

Qualifications:
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical engineering or a related field with 10+ years of experience,
  • Proven experience in hardware design and development, including block diagrams, schematics, and electrical requirements.
  • Strong understanding of system architecture and the ability to work collaboratively with System Level Architects.
  • Familiarity with NAND flash memory technology, controller design, and storage system behavior.
  • Proficiency in EDA schematic and simulation tools such as Cadence Allegro System Capture, Synopsys Design Compiler, Mentor Graphics PADS, Altium Designer, and OrCAD.
  • Experience with ASIC architecture in storage products (e.g., SSD, eMMC, UFS, USB) and high-speed serial and parallel interfaces (e.g., PCIe, MIPI, DDR, LPDDR, ONFI).

Preferred Skills
  • Experience in semiconductor package design, architecture, or integration .
  • Experience with schematics, netlists, connectivity definition, and verification .
  • Understanding of ASIC/package and System-in-Package integration .
  • Knowledge of signal integrity, power integrity, and package electrical design .
  • Familiarity with memory and high-speed interfaces such as DDR/LPDDR, ONFI, UFS, and PCIe.
  • Experience with EDA tools for schematic capture, package design, or connectivity verification .
  • Familiarity with advanced packaging, substrate technologies, and assembly processes .
  • Strong cross-functional technical leadership and problem-solving skills .
  • Experience and/or interest in developing Agentic AI workflows into current or future processes.

The US base salary range that Micron Technology estimates it could pay for this full-time position is:
$143,000.00 - $398,000.00 a year
Additional compensation may include benefits, bonuses and equity.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [email protected] or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Skills Required

  • Master's degree or equivalent practical experience in electrical engineering, computer engineering, computer science, or a related field
  • 6+ years of extensive hands-on experience in memory systems package design, signaling, I/O design, and power distribution network design
  • Deep understanding of memory timing, signaling, power, and package process technology
  • Working knowledge of EDA tools for electronic packaging design, analysis, and simulation, including Cadence, Siemens, and Ansys tools
  • Experience applying AI or large language models for engineering efficiency
  • Master's degree or PhD in a related technical field
  • Recognized technical leadership across multiple products
  • Experience in signal and power integrity analysis, mechanical and reliability analysis, and thermal analysis
  • Expertise in memory systems architecture
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The Company
HQ: Boise, ID
45,000 Employees
Year Founded: 1978

What We Do

We are a world leader in innovative memory solutions that transform how the world uses information to enrich life for all. For over 45 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

Why Work With Us

Global opportunities, team member development, and career advancement—Micron invests in you and celebrates your skills, a growth mindset, and the tenacity to strive. At Micron, everyone innovates.

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Micron Technology Offices

Hybrid Workspace

Employees engage in a combination of remote and on-site work.

Micron recognizes the importance of maintaining a healthy work-life balance to foster a culture of collaboration, innovation and meet the needs of the business. In alignment with these values, we offer four flexible work arrangement options

Typical time on-site: Flexible
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